TDA75610LVSM vs 935234730112 feature comparison

TDA75610LVSM STMicroelectronics

Buy Now Datasheet

935234730112 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Package Description ZIP, ZIP27H,.08,.7,40 POWER, PLASTIC, SOT-411-1, DIL-BENT-SIL, 23 PIN
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Bandwidth-Nom 22 kHz 20 kHz
Consumer IC Type AUDIO AMPLIFIER AUDIO AMPLIFIER
Gain 26 dB 26 dB
Harmonic Distortion 10% 30%
JESD-30 Code R-XZIP-T27 R-PZIP-T23
Number of Channels 4 4
Number of Functions 1 1
Number of Terminals 27 23
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 44 W 35 W
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code ZIP ZIP
Package Equivalence Code ZIP27H,.08,.7,40 ZIP23,.2,.17
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 6 V 6 V
Surface Mount NO NO
Technology BCDMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 1 mm 1.27 mm
Terminal Position ZIG-ZAG ZIG-ZAG
Base Number Matches 1 1
Part Package Code ZIP
Pin Count 23
Length 30.15 mm
Peak Reflow Temperature (Cel) 245
Seated Height-Max 16.9 mm
Supply Current-Max 360 mA
Time@Peak Reflow Temperature-Max (s) 40
Width 4.45 mm

Compare TDA75610LVSM with alternatives

Compare 935234730112 with alternatives