TDA75610LVSM vs 935234730112 feature comparison

TDA75610LVSM STMicroelectronics

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935234730112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Package Description ZIP, ZIP27H,.08,.7,40 POWER, PLASTIC, SOT-411-1, DIL-BENT-SIL, 23 PIN
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Bandwidth-Nom 22 kHz 20 kHz
Consumer IC Type AUDIO AMPLIFIER AUDIO AMPLIFIER
Gain 26 dB 26 dB
Harmonic Distortion 10% 30%
JESD-30 Code R-XZFM-T27 R-PZIP-T23
Number of Channels 4 4
Number of Functions 1 1
Number of Terminals 27 23
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 44 W 35 W
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code ZIP ZIP
Package Equivalence Code ZIP27H,.08,.7,40 ZIP23,.2,.17
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 6 V 6 V
Surface Mount NO NO
Technology BCDMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 1 mm 1.27 mm
Terminal Position ZIG-ZAG ZIG-ZAG
Base Number Matches 1 1
Part Package Code ZIP
Pin Count 23
Length 30.15 mm
Peak Reflow Temperature (Cel) 245
Seated Height-Max 16.9 mm
Supply Current-Max 360 mA
Time@Peak Reflow Temperature-Max (s) 40
Width 4.45 mm

Compare TDA75610LVSM with alternatives

Compare 935234730112 with alternatives