TDA75610LVSM
vs
935234730112
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
Package Description |
ZIP, ZIP27H,.08,.7,40
|
POWER, PLASTIC, SOT-411-1, DIL-BENT-SIL, 23 PIN
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
22 kHz
|
20 kHz
|
Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Gain |
26 dB
|
26 dB
|
Harmonic Distortion |
10%
|
30%
|
JESD-30 Code |
R-XZFM-T27
|
R-PZIP-T23
|
Number of Channels |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
27
|
23
|
Operating Temperature-Max |
105 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
44 W
|
35 W
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
ZIP
|
ZIP
|
Package Equivalence Code |
ZIP27H,.08,.7,40
|
ZIP23,.2,.17
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
6 V
|
6 V
|
Surface Mount |
NO
|
NO
|
Technology |
BCDMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
1 mm
|
1.27 mm
|
Terminal Position |
ZIG-ZAG
|
ZIG-ZAG
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
ZIP
|
Pin Count |
|
23
|
Length |
|
30.15 mm
|
Peak Reflow Temperature (Cel) |
|
245
|
Seated Height-Max |
|
16.9 mm
|
Supply Current-Max |
|
360 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
4.45 mm
|
|
|
|
Compare TDA75610LVSM with alternatives
Compare 935234730112 with alternatives