74LVCH16245AEV
vs
74LVC16245ADL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
BGA
Package Description
VFBGA, BGA56,6X10,25
Pin Count
56
Manufacturer Package Code
SOT702-1
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH DIRECTION CONTROL
Control Type
COMMON CONTROL
COMMON CONTROL
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
LVC/LCX/Z
JESD-30 Code
R-PBGA-B56
R-PDSO-G48
JESD-609 Code
e0
Length
7 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS TRANSCEIVER
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
2
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
Number of Terminals
56
48
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
SSOP
Package Equivalence Code
BGA56,6X10,25
SSOP48,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
6 ns
4.5 ns
Propagation Delay (tpd)
6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.5 mm
Base Number Matches
3
3
Packing Method
TUBE
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