74LVCH16245AEV
vs
74LVC16245ABX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
BGA
Package Description
VFBGA, BGA56,6X10,25
HVQCCN,
Pin Count
56
Manufacturer Package Code
SOT702-1
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH DIRECTION CONTROL
WITH DIRECTION CONTROL
Control Type
COMMON CONTROL
Count Direction
BIDIRECTIONAL
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PBGA-B56
R-PQCC-N60
JESD-609 Code
e0
Length
7 mm
6 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS TRANSCEIVER
BUS TRANSCEIVER
Max I(ol)
0.024 A
Moisture Sensitivity Level
2
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
56
60
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
HVQCCN
Package Equivalence Code
BGA56,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
6 ns
Propagation Delay (tpd)
6 ns
13.8 ns
Qualification Status
Not Qualified
Seated Height-Max
1 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
4.5 mm
4 mm
Base Number Matches
3
2
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