74LVCH16245AEV vs 74LVC16245ADGG,118 feature comparison

74LVCH16245AEV Philips Semiconductors

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74LVC16245ADGG,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description FBGA, BGA56,6X10,25 6.10 MM, ROHS COMPLIANT, PLASTIC, MO-153, SOT362-1, TSSOP-48
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
JESD-30 Code R-PBGA-B56 R-PDSO-G48
JESD-609 Code e0 e4
Max I(ol) 0.024 A
Number of Bits 8
Number of Functions 2 2
Number of Terminals 56 48
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA TSSOP
Package Equivalence Code BGA56,6X10,25 TSSOP48,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup 4.5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn63Pb37) NICKEL PALLADIUM GOLD
Terminal Form BALL GULL WING
Terminal Pitch 0.635 mm 0.5 mm
Terminal Position BOTTOM DUAL
Base Number Matches 3 2
Part Package Code TSSOP
Pin Count 48
Manufacturer Package Code SOT362-1
Additional Feature WITH DIRECTION CONTROL
Family LVC/LCX/Z
Length 12.5 mm
Logic IC Type BUS TRANSCEIVER
Moisture Sensitivity Level 1
Number of Ports 2
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 6 ns
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Time@Peak Reflow Temperature-Max (s) 30
Width 6.1 mm

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