Findchips: Compare 74LVC3G17GT-G vs 74LVC3G17GM,125

74LVC3G17GT-G vs 74LVC3G17GM,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Package Description	SON, SOLCC8,.04,20	1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	R-PDSO-N8	R-PBCC-B8
Load Capacitance (CL)	50 pF
Logic IC Type	BUFFER	BUFFER
Max I(ol)	0.024 A
Number of Terminals	8	8
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SON	VBCC
Package Equivalence Code	SOLCC8,.04,20	LCC8,.06SQ,20
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	CHIP CARRIER, VERY THIN PROFILE
Packing Method	TR	TR
Prop. Delay@Nom-Sup	7.1 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	YES	YES
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Form	NO LEAD	BUTT
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	DUAL	BOTTOM
Base Number Matches	1	2
Part Package Code		QFN
Pin Count		8
Manufacturer Package Code		SOT902-2
Factory Lead Time		4 Weeks
Family		LVC/LCX/Z
JESD-609 Code		e4
Length		1.95 mm
Moisture Sensitivity Level		1
Number of Functions		3
Number of Inputs		1
Peak Reflow Temperature (Cel)		260
Propagation Delay (tpd)		13.1 ns
Seated Height-Max		0.5 mm
Supply Voltage-Max (Vsup)		5.5 V
Supply Voltage-Min (Vsup)		1.65 V
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		30
Width		0.95 mm
	Logic » Gates	Logic » Gates