Findchips: Compare 74LVC32245AEC,518 vs IDT74LVCH32245ABF8

74LVC32245AEC,518 vs IDT74LVCH32245ABF8 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	RENESAS ELECTRONICS CORP
Part Package Code	BGA
Package Description	13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT536-1, LFBGA-96	LFBGA,
Pin Count	96
Manufacturer Package Code	SOT536-1
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	4 Weeks
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PBGA-B96	R-PBGA-B96
Length	13.5 mm	13.5 mm
Logic IC Type	BUS TRANSCEIVER	BUS TRANSCEIVER
Moisture Sensitivity Level	4	3
Number of Bits	8	8
Number of Functions	4	4
Number of Ports	2	2
Number of Terminals	96	96
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	3-STATE	3-STATE
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	LFBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)	4.7 ns	4.7 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.5 mm	1.5 mm
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	1.2 V	2.7 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Width	5.5 mm	5.5 mm
Base Number Matches	2	2
ECCN Code		EAR99
Additional Feature		WITH DIRECTION CONTROL
JESD-609 Code		e0
Terminal Finish		TIN LEAD
	Logic » Bus Driver/Transceivers	Logic » Bus Driver/Transceivers