74LVC32245AEC,518 vs SN74LVCHR32245AKR feature comparison

74LVC32245AEC,518 NXP Semiconductors

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SN74LVCHR32245AKR Texas Instruments

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description 13.50 X 5.50 MM, 1.05 MM HEIGHT, PLASTIC, SOT536-1, LFBGA-96 LFBGA-96
Pin Count 96 96
Manufacturer Package Code SOT536-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 13.5 mm 13.5 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Moisture Sensitivity Level 4 2
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE WITH SERIES RESISTOR
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 4.7 ns 12.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 5.5 mm 5.5 mm
Base Number Matches 2 1
ECCN Code EAR99
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
JESD-609 Code e0
Max I(ol) 0.012 A
Package Equivalence Code BGA96,6X16,32
Packing Method TR
Peak Reflow Temperature (Cel) 235
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 4.8 ns
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 20

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