74LVC158DB-T
vs
SN74LVC157APWE4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Package Description
SSOP,
GREEN, PLASTIC, TSSOP-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
6.2 mm
5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
4.4 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
TSSOP
Pin Count
16
ECCN Code
EAR99
Date Of Intro
1993-04-01
Samacsys Manufacturer
Texas Instruments
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Bits
2
Package Equivalence Code
TSSOP16,.25
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
6.4 ns
Propagation Delay (tpd)
15.5 ns
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Compare 74LVC158DB-T with alternatives
Compare SN74LVC157APWE4 with alternatives