72V01L35JG
vs
72V01L35J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
PLCC
Package Description
QCCJ, LDCC32,.5X.6
PLASTIC, LCC-32
Pin Count
32
32
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
35 ns
Clock Frequency-Max (fCLK)
22.2 MHz
22.2 MHz
Cycle Time
45 ns
45 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e3
e0
Length
13.995 mm
13.9954 mm
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512X9
512X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Seated Height-Max
3.556 mm
3.556 mm
Standby Current-Max
0.005 A
0.0003 A
Supply Current-Max
0.06 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
20
Width
11.455 mm
11.4554 mm
Base Number Matches
1
1
Manufacturer Package Code
PL32
Additional Feature
RETRANSMIT
Qualification Status
Not Qualified
Compare 72V01L35JG with alternatives
Compare 72V01L35J with alternatives