72V01L35JG
vs
7201LA35SOG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
SOIC
Package Description
QCCJ, LDCC32,.5X.6
SOP,
Pin Count
32
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
35 ns
Clock Frequency-Max (fCLK)
22.2 MHz
Cycle Time
45 ns
45 ns
JESD-30 Code
R-PQCC-J32
R-PDSO-G28
JESD-609 Code
e3
e3
Length
13.995 mm
18.3642 mm
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512X9
512X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
SOP
Package Equivalence Code
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Seated Height-Max
3.556 mm
3.048 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.06 mA
0.08 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
11.455 mm
8.763 mm
Base Number Matches
1
1
Additional Feature
RETRANSMIT
Qualification Status
Not Qualified
Compare 72V01L35JG with alternatives
Compare 7201LA35SOG8 with alternatives