7008L55PFGI
vs
7008S55PFG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFP,
QFP, QFP100,.63SQ,20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Date Of Intro
2018-01-26
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
Memory Density
524288 bit
524288 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX8
64KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Pbfree Code
Rohs Code
I/O Type
COMMON
JESD-609 Code
e3
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63SQ,20
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.27 mA
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
30
Compare 7008L55PFGI with alternatives
Compare 7008S55PFG with alternatives