7008L55PFGI vs IDT7008L55PFG feature comparison

7008L55PFGI Integrated Device Technology Inc

Buy Now Datasheet

IDT7008L55PFG Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description QFP, LFQFP, QFP100,.63SQ,20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 2018-01-26
Access Time-Max 55 ns 55 ns
JESD-30 Code S-PQFP-G100 S-PQFP-G100
Memory Density 524288 bit 524288 bit
Memory IC Type DUAL-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64KX8 64KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code QFP
Pin Count 100
I/O Type COMMON
JESD-609 Code e3
Length 14 mm
Moisture Sensitivity Level 3
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63SQ,20
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Standby Current-Max 0.005 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.23 mA
Terminal Finish Matte Tin (Sn) - annealed
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm

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