7008L55PFGI
vs
IDT7008S55PFI9
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFP,
14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Date Of Intro
2018-01-26
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
Memory Density
524288 bit
524288 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX8
64KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
QFP
Pin Count
100
Additional Feature
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE
JESD-609 Code
e0
Length
14 mm
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Output Enable
YES
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
Compare 7008L55PFGI with alternatives
Compare IDT7008S55PFI9 with alternatives