65LBC174AM16DWREP vs DS96F174MMW8 feature comparison

65LBC174AM16DWREP Texas Instruments

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DS96F174MMW8 National Semiconductor Corporation

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Package Description SOIC-16 DIE, WAFER
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2019-11-21
Samacsys Manufacturer Texas Instruments
Differential Output YES YES
Driver Number of Bits 4 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482 EIA-422; EIA-485
JESD-30 Code R-PDSO-G16 X-XUUC-N
JESD-609 Code e4
Length 10.3 mm
Moisture Sensitivity Level 2
Number of Functions 4 4
Number of Terminals 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE UNCASED CHIP
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.65 mm
Supply Current-Max 23 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BICMOS BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) 30
Transmit Delay-Max 16 ns 25 ns
Width 7.5 mm
Base Number Matches 1 1
High Level Input Current-Max 0.00002 A
Out Swing-Min 1.5 V
Output Characteristics 3-STATE
Package Equivalence Code WAFER
Qualification Status Not Qualified
Receive Delay-Max
Screening Level 38535Q/M;38534H;883B

Compare 65LBC174AM16DWREP with alternatives

Compare DS96F174MMW8 with alternatives