5962R9687302VXC
vs
5962F9687302VXX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
0.600 X 1.400 INCH, 2.54 MM PITCH, CERAMIC, DIP-28
|
DIP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
100 ns
|
120 ns
|
| JESD-30 Code |
R-CDIP-T28
|
R-CDIP-T28
|
| JESD-609 Code |
e4
|
|
| Length |
35.56 mm
|
35.56 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
MIL-PRF-38535 Class V
|
| Seated Height-Max |
4.445 mm
|
4.445 mm
|
| Supply Current-Max |
0.03 mA
|
0.03 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
100k Rad(Si) V
|
300k Rad(Si) V
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5962R9687302VXC with alternatives
Compare 5962F9687302VXX with alternatives