5962F9687302VXX
vs
5962H9687302VXC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code
DIP
Package Description
DIP,
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.1.A
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
120 ns
45 ns
JESD-30 Code
R-CDIP-T28
R-XDIP-T28
Length
35.56 mm
Memory Density
262144 bit
65536 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
32000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
38535V;38534K;883S
Seated Height-Max
4.445 mm
Supply Current-Max
0.03 mA
0.085 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
300k Rad(Si) V
1M Rad(Si) V
Width
15.24 mm
Base Number Matches
2
3
Package Equivalence Code
DIP28,.6
Standby Current-Max
0.0005 A
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