5962-9755701HYC
vs
HCPL-7850100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
BROADCOM INC
AGILENT TECHNOLOGIES INC
Package Description
DIP, SMDIP8,.3
SOI,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Factory Lead Time
16 Weeks
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
0.1 MHz
100 MHz
Common Mode Voltage-Max
2.8 V
JESD-30 Code
R-CDIP-T8
R-PDSO-B8
JESD-609 Code
e4
Length
9.655 mm
9.655 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
SOI
Package Equivalence Code
SMDIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38534 Class H
Seated Height-Max
4.32 mm
4.32 mm
Supply Current-Max
15.5 mA
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
HYBRID
Temperature Grade
MILITARY
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
BUTT
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Voltage Gain-Max
8.4
8.4
Voltage Gain-Min
7.6
7.6
Width
7.62 mm
7.62 mm
Base Number Matches
4
3
Part Package Code
SOIC
Pin Count
8
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-9755701HYC with alternatives
Compare HCPL-7850100 with alternatives