5962-9755701HYC vs 5962-9755701HYA feature comparison

5962-9755701HYC Avago Technologies

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5962-9755701HYA Hewlett Packard Co

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer AVAGO TECHNOLOGIES INC HEWLETT PACKARD CO
Part Package Code DIP DIP
Package Description DIP, SMDIP8,.3 ,
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 0.1 MHz 100 MHz
Common Mode Voltage-Max 2.8 V
JESD-30 Code R-CDIP-T8 R-PDIP-T8
JESD-609 Code e4 e0
Length 9.655 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code SMDIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38534 Class H
Seated Height-Max 4.32 mm
Supply Current-Max 15.5 mA
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology HYBRID
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Voltage Gain-Max 8.4 8.4
Voltage Gain-Min 7.6 7.6
Width 7.62 mm
Base Number Matches 4 4

Compare 5962-9755701HYC with alternatives

Compare 5962-9755701HYA with alternatives