5962-9755701HYC
vs
HCPL-7851
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
BROADCOM INC
HEWLETT PACKARD CO
Package Description
DIP, SMDIP8,.3
,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
16 Weeks
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
0.1 MHz
100 MHz
Common Mode Voltage-Max
2.8 V
JESD-30 Code
R-CDIP-T8
R-PDIP-T8
JESD-609 Code
e4
Length
9.655 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
SMDIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38534 Class H
Seated Height-Max
4.32 mm
Supply Current-Max
15.5 mA
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
HYBRID
Temperature Grade
MILITARY
MILITARY
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Voltage Gain-Max
8.4
8.4
Voltage Gain-Min
7.6
7.6
Width
7.62 mm
Base Number Matches
4
4
Part Package Code
DIP
Pin Count
8
Compare 5962-9755701HYC with alternatives
Compare HCPL-7851 with alternatives