5962-9153601MYA
vs
5962-9153601MYX
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
DFP,
|
QFF,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100K
|
100K
|
| JESD-30 Code |
S-XQFP-F24
|
S-GQFP-F24
|
| JESD-609 Code |
e0
|
|
| Length |
9.78 mm
|
9.398 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
1
|
1
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
QFF
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Propagation Delay (tpd) |
2.2 ns
|
2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883
|
| Seated Height-Max |
2.16 mm
|
2.159 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
9.78 mm
|
9.398 mm
|
| fmax-Min |
400 MHz
|
400 MHz
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare 5962-9153601MYA with alternatives
Compare 5962-9153601MYX with alternatives