5962-9153601MYX
vs
100150F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
PHILIPS SEMICONDUCTORS
Package Description
QFF,
DIP, DIP24,.4
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
100K
JESD-30 Code
S-GQFP-F24
R-XDIP-T24
Length
9.398 mm
Logic IC Type
D FLIP-FLOP
D LATCH
Number of Bits
1
6
Number of Functions
3
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
QFF
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Propagation Delay (tpd)
2 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
2.159 mm
Surface Mount
YES
NO
Technology
ECL
ECL
Temperature Grade
MILITARY
OTHER
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Trigger Type
POSITIVE EDGE
Width
9.398 mm
fmax-Min
400 MHz
Base Number Matches
3
2
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP24,.4
Power Supply Current-Max (ICC)
159 mA
Prop. Delay@Nom-Sup
2.6 ns
Terminal Finish
Tin/Lead (Sn/Pb)
Compare 5962-9153601MYX with alternatives