5962-9065802LA vs 5962-9065804JX feature comparison

5962-9065802LA STMicroelectronics

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5962-9065804JX Waferscale Integration Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS WAFERSCALE INTEGRATION INC
Part Package Code DIP
Package Description 0.300 INCH, WINDOWED, THIN, CERDIP-24 CERAMIC, DIP-24
Pin Count 24
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 55 ns 35 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0
Length 32.005 mm
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 4KX8 4KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP DIP
Package Equivalence Code DIP24,.3 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883
Seated Height-Max 5.08 mm
Standby Current-Max 0.035 A 0.035 A
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1

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