5962-9065802LA
vs
LD2732A-20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
WAFERSCALE INTEGRATION INC
INTEL CORP
Package Description
0.300 INCH, WINDOWED, THIN, CERDIP-24
DIP, DIP24,.6
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
55 ns
250 ns
JESD-30 Code
R-GDIP-T24
R-CDIP-T24
JESD-609 Code
e0
e0
Length
32.005 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
4KX8
4KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
HMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
4
1
Rohs Code
Part Package Code
DIP
Pin Count
24
I/O Type
COMMON
Package Equivalence Code
DIP24,.6
Programming Voltage
21 V
Supply Current-Max
0.125 mA
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