5962-89841013X
vs
TIBPAL20R8-10MWB
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
DFP
|
Package Description |
QCCN,
|
DFP, FL24,.35
|
Pin Count |
28
|
24
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
PAL WITH MACROCELLS; 10 MACROCELLS
|
|
Clock Frequency-Max |
22 MHz
|
50 MHz
|
JESD-30 Code |
S-CQCC-N28
|
R-GDFP-F24
|
Length |
11.43 mm
|
14.355 mm
|
Number of Dedicated Inputs |
11
|
12
|
Number of I/O Lines |
10
|
|
Number of Terminals |
28
|
24
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
11 DEDICATED INPUTS, 10 I/O
|
12 DEDICATED INPUTS, 0 I/O
|
Output Function |
MACROCELL
|
REGISTERED
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCN
|
DFP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Programmable Logic Type |
EE PLD
|
OT PLD
|
Propagation Delay |
30 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
2.29 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
NO LEAD
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
11.43 mm
|
9.085 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Architecture |
|
PAL-TYPE
|
Number of Inputs |
|
12
|
Number of Outputs |
|
8
|
Number of Product Terms |
|
64
|
Package Equivalence Code |
|
FL24,.35
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 5962-89841013X with alternatives
Compare TIBPAL20R8-10MWB with alternatives