5962-89841013X vs 5962-8984101LA feature comparison

5962-89841013X QP Semiconductor

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5962-8984101LA Teledyne e2v

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Part Life Cycle Code Transferred Active
Ihs Manufacturer QP SEMICONDUCTOR INC TELEDYNE E2V (UK) LTD
Package Description QCCN, CERAMIC, DIP-24
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 10 MACROCELLS; 1 EXTERNAL CLOCK; REGISTER PRELOAD; SHARED INPUT/CLOCK IT ALSO AVAILABLE IN GDIP-24 PACKAGE
Clock Frequency-Max 22 MHz 22 MHz
JESD-30 Code S-CQCC-N28 R-CDIP-T24
Length 11.43 mm
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Terminals 28 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN DIP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Programmable Logic Type EE PLD EE PLD
Propagation Delay 30 ns 30 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 2.54 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm
Base Number Matches 5 7
Part Package Code DIP
Pin Count 24
Architecture PAL-TYPE
JESD-609 Code e0
Number of Inputs 22
Number of Outputs 10
Number of Product Terms 132
Package Equivalence Code DIP24,.3
Screening Level MIL-PRF-38535; MIL-STD-883
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Terminal Finish TIN LEAD

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