5962-8959834MXA
vs
TC55V2001TR-10L
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
TOSHIBA CORP
Part Package Code
DIP
TSOP1
Package Description
DIP,
8 X 20 MM, 0.50 MM PITCH, REVERSE, PLASTIC, TSOP1-32
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
55 ns
100 ns
JESD-30 Code
R-GDIP-T32
R-PDSO-G32
Length
40.64 mm
18.4 mm
Memory Density
1048576 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
262144 words
Number of Words Code
128000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
256KX8
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
TSOP1-R
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
3.937 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
15.24 mm
8 mm
Base Number Matches
8
1
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 5962-8959834MXA with alternatives
Compare TC55V2001TR-10L with alternatives