Part Details for 5962-8959834MXA by Microsemi Corporation
Overview of 5962-8959834MXA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Consumer Electronics
Environmental Monitoring
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Smart Cities
Healthcare
Telecommunications
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-8959834MXA
5962-8959834MXA CAD Models
5962-8959834MXA Part Data Attributes
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5962-8959834MXA
Microsemi Corporation
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Datasheet
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5962-8959834MXA
Microsemi Corporation
Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, CERAMIC, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-GDIP-T32 | |
| Length | 40.64 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 3.937 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15.24 mm |
Alternate Parts for 5962-8959834MXA
This table gives cross-reference parts and alternative options found for 5962-8959834MXA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8959834MXA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| EDI88130LPS55CC | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-8959834MXA vs EDI88130LPS55CC |
| 5962-8959817MXA | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, CERAMIC, DIP-32 | Microsemi Corporation | 5962-8959834MXA vs 5962-8959817MXA |
| EDI88130CS55CC | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-8959834MXA vs EDI88130CS55CC |
| DPS128M8AN-55B | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 | B&B Electronics Manufacturing Company | 5962-8959834MXA vs DPS128M8AN-55B |
| EDI88130LPS55CM | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-8959834MXA vs EDI88130LPS55CM |
| EDI88130LPS55CB | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-8959834MXA vs EDI88130LPS55CB |
| 5962-8959834MXX | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-8959834MXA vs 5962-8959834MXX |
| EDI88130CS55CB | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-8959834MXA vs EDI88130CS55CB |