10174N vs 10H574/BEAJC feature comparison

10174N YAGEO Corporation

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10H574/BEAJC Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS MOTOROLA INC
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 10K 10H
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -30 °C -55 °C
Output Characteristics OPEN-EMITTER OPEN-EMITTER
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 6.4 ns 3.6 ns
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology ECL ECL
Temperature Grade OTHER MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Length 19.495 mm
Package Equivalence Code DIP16,.3
Power Supply Current-Max (ICC) 80 mA
Prop. Delay@Nom-Sup 3.6 ns
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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