10H574/BEAJC vs MC10174P feature comparison

10H574/BEAJC Motorola Mobility LLC

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MC10174P Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Part Package Code DIP
Package Description DIP, DIP16,.3 PLASTIC, DIP-16
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 10H 10K
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 19.495 mm 19.175 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -30 °C
Output Characteristics OPEN-EMITTER OPEN-EMITTER
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 80 mA 80 mA
Prop. Delay@Nom-Sup 3.6 ns 6.6 ns
Propagation Delay (tpd) 3.6 ns 6.6 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 4.44 mm
Surface Mount NO NO
Technology ECL ECL
Temperature Grade MILITARY OTHER
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 5
Rohs Code No

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