100371MD8
vs
100164DCQR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DIE,
DIP, DIP24,.4
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
100K
100K
JESD-30 Code
R-XUUC-N24
R-GDIP-T24
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
3
1
Number of Inputs
4
16
Number of Outputs
1
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
Output Polarity
COMPLEMENTARY
TRUE
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
DIP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Propagation Delay (tpd)
1.7 ns
3.6 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
NO
Technology
ECL
ECL
Temperature Grade
MILITARY
OTHER
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Output Characteristics
OPEN-EMITTER
Power Supply Current-Max (ICC)
105 mA
Prop. Delay@Nom-Sup
2.55 ns
Seated Height-Max
5.72 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
10.16 mm
Compare 100371MD8 with alternatives
Compare 100164DCQR with alternatives