Parametric results for: am27s191sa65jcbs under OTP ROMs

All Filters Access Time-Max JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Supply Voltage-Nom (Vsup) Access Time-Max (8)

10 ns 1 20 ns 1 25 ns 2 30 ns 6 35 ns 3 45 ns 1 55 ns 3 200 ns 2

Min (ns) - Max (ns)

19 hits Apply

R-CQCC-N32 5 R-GDFP-F24 2 R-GDIP-T24 3 R-PDIP-T24 2 S-CQCC-N28 5 S-PQCC-J28 2

19 hits Apply

e0 15

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11.43 mm 5 11.5062 mm 2 13.97 mm 5 15.367 mm 2 32.004 mm 2 32.0675 mm 3

Min (mm) - Max (mm)

19 hits Apply

Manufacturer (2)

AMD 16 Rochester Electronics LLC 3

19 hits Apply

Memory Density (6)

1.024 kbit 1 2.048 kbit 1 4.096 kbit 4 16.384 kbit 5 65.536 kbit 6 262.144 kbit 2

Min (bit) - Max (bit)

19 hits Apply

OTP ROM 19

19 hits Apply

Memory Width (2)

4 6 8 13

Min - Max

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1.0 19

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24 7 28 7 32 5

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2.048 k 19

19 hits Apply

256.0 1 512.0 1 1000.0 4 2000.0 5 8000.0 6 32000.0 2

Min - Max

19 hits Apply

ASYNCHRONOUS 19

19 hits Apply

75.0 °C 10 125.0 °C 9

Min (°C) - Max (°C)

19 hits Apply

-55.0 °C 9 0.0 °C 10

Min (°C) - Max (°C)

19 hits Apply

Organization (6)

1KX4 4 256X4 1 2KX8 5 32KX8 2 512X4 1 8KX8 6

19 hits Apply

3-STATE 16

19 hits Apply

CERAMIC, GLASS-SEALED 5 CERAMIC, METAL-SEALED COFIRED 10 PLASTIC/EPOXY 4

19 hits Apply

DFP 2 DIP 5 QCCJ 2 QCCN 10

19 hits Apply

DIP24,.6 5 FL24,.4 1 LCC28,.45SQ 4 LCC32,.45X.55 4 LDCC28,.5SQ 1

19 hits Apply

RECTANGULAR 12 SQUARE 7

19 hits Apply

CHIP CARRIER 12 FLATPACK 2 IN-LINE 5

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Supply Voltage-Nom (Vsup) (1)

5 V 18

19 hits Apply