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MPC5534MVM80
NXP Semiconductors
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$23.7305 | Yes | Not Recommended | 32 | 80 MHz | 1048576 | 65536 | 40 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | YES | NO | YES | 8 | YES | FLASH | 250 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B208 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 208 | PLASTIC/EPOXY | BGA | BGA208,16X16,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2 mm | 17 mm | 17 mm | NXP SEMICONDUCTORS | 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MO-151AAF-1, MAPBGA-208 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||||||||||
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MPC555LFCVR40
NXP Semiconductors
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$27.6665 | Yes | End Of Life | 32 | 40 MHz | 458752 | 26624 | MPC500 | 32 | 24 | 20 MHz | 101 | 3 | YES | 3.3 V | MICROCONTROLLER, RISC | HCMOS | ALSO REQUIRES 5V SUPPLY | YES | NO | NO | FLOATING POINT | YES | YES | 4 | 8 | 8 | YES | FLASH | 3.6 V | 3.3 V | INDUSTRIAL | S-PBGA-B272 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | 1997-09-16 | ||||||||
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MPC555LFMZP40
NXP Semiconductors
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$30.4354 | No | End Of Life | 32 | 40 MHz | 458752 | 26624 | MPC500 | 32 | 24 | 20 MHz | 101 | 3 | YES | 3.3 V | MICROCONTROLLER, RISC | HCMOS | IT ALSO OPERATES AT 5 V | YES | NO | NO | FLOATING-POINT | YES | YES | YES | 8 | 4 | 8 | 8 | YES | FLASH | 250 mA | 3.6 V | 3 V | AUTOMOTIVE | S-PBGA-B272 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 235 | 30 | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | 1997-09-16 | |||||
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MPC5553MVZ132
NXP Semiconductors
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$34.4120 | Yes | Not Recommended | 32 | 132 MHz | 1572864 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 510 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B324 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 324 | PLASTIC/EPOXY | BGA | BGA324,22X22,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 23 mm | 23 mm | NXP SEMICONDUCTORS | 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAJ-1, BGA-324 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||||
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MPC5553MZQ132
NXP Semiconductors
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$34.9361 | No | Not Recommended | 32 | 132 MHz | 1572864 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 510 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B324 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,22X22,40 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 23 mm | 23 mm | NXP SEMICONDUCTORS | 23 X 23 MM, 1 MM PITCH, PLASTIC, MS-034AAJ-1, BGA-324 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||||
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MPC5553MZP132
NXP Semiconductors
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$38.7727 | No | End Of Life | 32 | 132 MHz | 1572864 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 510 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | BGA | BGA416,26X26,40 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||||
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MPC5554MZP132
Freescale Semiconductor
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$45.5806 | No | No | Transferred | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | TIN LEAD SILVER | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | FREESCALE SEMICONDUCTOR INC | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | BGA | 416 | |||||||||||||
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MPC5517GAVMG80
NXP Semiconductors
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$46.0567 | Yes | Active | 32 | 80 MHz | 196608 | 81920 | E200 | 32 | 32 | 16 MHz | 130 | YES | 5 V | MICROCONTROLLER, RISC | CMOS | YES | YES | NO | FLASH | 5.25 V | 4.5 V | INDUSTRIAL | S-PBGA-B208 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 208 | PLASTIC/EPOXY | BGA | BGA208,16X16,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | NXP SEMICONDUCTORS | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||||||||
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MPC5554MZP132
NXP Semiconductors
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$51.1999 | No | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||||||
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MPC5553MVR132
NXP Semiconductors
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$53.6231 | Yes | End Of Life | 32 | 132 MHz | 1572864 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 510 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 4 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | BGA | BGA416,26X26,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP |