Findchips: Parametric Search Results for MCZ33810EK


Select Parts		Part Number

		MCZ33810EK NXP Semiconductors
		MCZ33810EKR2 NXP Semiconductors
		MCZ33810EKR2 Rochester Electronics LLC
		MCZ33810EKR2 Freescale Semiconductor
		MCZ33810EK Freescale Semiconductor
		MCZ33810EK/R2 Freescale Semiconductor

				Most Relevant					Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Driver Number of Bits	Output Peak Current Limit-Nom	Turn-off Time	Turn-on Time	Interface IC Type	Built-in Protections	Number of Functions	Output Current Flow Direction	Output Current-Max	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$6.7252

Yes

Active

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

1 A

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

NXP SEMICONDUCTORS

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

EAR99

8542.39.00.01

NXP

$8.0481

Yes

Active

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

1 A

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

NXP SEMICONDUCTORS

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

EAR99

8542.39.00.01

NXP

Check for Price

Yes

Active

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

COMMERCIAL

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

ROCHESTER ELECTRONICS LLC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

unknown

SOIC

Check for Price

Yes

Transferred

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

1 A

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

EAR99

8542.39.00.01

NXP

SOIC

Check for Price

Yes

Transferred

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

1 A

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

EAR99

8542.39.00.01

NXP

SOIC

Check for Price

Active

5 V

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SOURCE AND SINK

5.5 V

3 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

unknown

SOIC

Compare

MCZ33810EK

NXP Semiconductors

$6.7252

Yes

Active

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

1 A

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

NXP SEMICONDUCTORS

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

EAR99

8542.39.00.01

NXP

MCZ33810EKR2

NXP Semiconductors

$8.0481

Yes

Active

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

1 A

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

NXP SEMICONDUCTORS

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

EAR99

8542.39.00.01

NXP

MCZ33810EKR2

Rochester Electronics LLC

Check for Price

Yes

Active

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

COMMERCIAL

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

ROCHESTER ELECTRONICS LLC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

unknown

SOIC

MCZ33810EKR2

Freescale Semiconductor

Check for Price

Yes

Transferred

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

1 A

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

EAR99

8542.39.00.01

NXP

SOIC

MCZ33810EK

Freescale Semiconductor

Check for Price

Yes

Transferred

13 V

6 A

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT

SINK

1 A

36 V

4.5 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

MATTE TIN

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

compliant

EAR99

8542.39.00.01

NXP

SOIC

MCZ33810EK/R2

Freescale Semiconductor

Check for Price

Active

5 V

5 µs

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

SOURCE AND SINK

5.5 V

3 V

YES

AUTOMOTIVE

R-PDSO-G32

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE

GULL WING

650 µm

DUAL

11 mm

2.45 mm

7.5 mm

FREESCALE SEMICONDUCTOR INC

0.65 MM PITCH, ROHS COMPLIANT, SOIC-32

unknown

SOIC

Parametric results for: MCZ33810EK under Peripheral Drivers