Parametric results for: M24C04 under EEPROMs

All Filters Additional Feature Alternate Memory Width Clock Frequency-Max (fCLK) Data Retention Time-Min Endurance I2C Control Byte JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Power Supplies Supply Voltage-Nom (Vsup)

16 BYTE PAGE WRITE; DATA RETENTION > 40 YEARS 111 16 BYTE PAGE WRITE; WRITE PROTECT; DATA RETENTION>40 YEARS 57 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS 26 ALSO AVAILABLE IN 100KHZ 4 DATA RETENTION > 40 YEARS 69

1,051 hits Apply

1 2

1,051 hits Apply

Clock Frequency-Max (fCLK) (4)

100 kHz 187 400 kHz 681 800 kHz 15 1 MHz 24

Min (MHz) - Max (MHz)

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10 2 40 738 50 6 100 43

Min - Max

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100000.0 Write/Erase Cycles 2 900000.0 Write/Erase Cycles 6 1000000.0 Write/Erase Cycles 691

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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101000MR 6 1010DDMR 693

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R-PBCC-B8 2 R-PDIP-T8 193 R-PDSO-G14 10 R-PDSO-G5 6 R-PDSO-G8 540 R-PDSO-N5 16 R-PDSO-N8 60 R-XDSO-N8 70 S-PDSO-G8 80 X-XUUC-N6 2

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e0 379 e3 100 e4 163

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1.7 mm 16 3 mm 198 4.4 mm 230 4.9 mm 269 9 mm 10 9.27 mm 89 9.55 mm 9 9.817 mm 84

Min (mm) - Max (mm)

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Manufacturer (6)

Fairchild Semiconductor Corporation 218 National Semiconductor Corporation 32 Rochester Electronics LLC 47 Shanghai Fudan Microelectronics Group Co Limited 72 STMicroelectronics 633 Texas Instruments 49

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Memory Density (1)

4.096 kbit 980

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EEPROM 1,019

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Memory Width (2)

1 131 8 849

Min - Max

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1 194 3 1 NOT APPLICABLE 4 NOT SPECIFIED 7

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1.0 907

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14 10 5 22 6 2 8 945

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512 words 849 4.096 k 131

Min (words) - Max (words)

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512.0 849 4000.0 131

Min - Max

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SYNCHRONOUS 907

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70.0 °C 170 85.0 °C 392 105.0 °C 12 125.0 °C 404

Min (°C) - Max (°C)

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-55.0 °C 9 -40.0 °C 733 -20.0 °C 66 0.0 °C 170

Min (°C) - Max (°C)

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Organization (2)

4KX1 131 512X8 849

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3-STATE 9 OPEN-DRAIN 140

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PLASTIC/EPOXY 907 UNSPECIFIED 72

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DIE 2 DIP 193 HVBCC 2 HVSON 89 SON 14 SOP 298 TSOP 6 TSSOP 332 VSON 43

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DIP8,.3 127 SOLCC8,.11,20 102 SOP14,.4 4 SOP8,.25 195 TSOP5/6,.11,37 6 TSSOP8,.19 80 TSSOP8,.25 184 WAFER 1

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RECTANGULAR 897 SQUARE 80 UNSPECIFIED 2

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CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE 2 IN-LINE 193 SMALL OUTLINE 312 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 89 SMALL OUTLINE, THIN PROFILE 6 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 332 SMALL OUTLINE, VERY THIN PROFILE 43 UNCASED CHIP 2

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Power Supplies (3)

2/5 V 5 3/5 V 5 5 V 12

1,051 hits Apply

Supply Voltage-Nom (Vsup) (5)

1.8 V 3 2.5 V 200 3 V 49 3.3 V 138 5 V 441

Min (V) - Max (V)

1,051 hits Apply