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LAN8700IC-AEZG-TR
Microchip Technology Inc
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$1.2557 | Yes | Active | 12.5 MBps | 25 MHz | YES | 3.3 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | IT ALSO HAS IEEE802.3AB NETWORK PROTOCOL | NO | SYNC, BYTE; ETHERNET | NRZI; BIPH-LEVEL (MANCHESTER) | YES | 4 | 41.3 mA | 3.6 V | 3 V | INDUSTRIAL | S-PQCC-N36 | e3 | 85 °C | -40 °C | TS 16949 | 36 | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | QFN-36 | compliant | EAR99 | 8542.39.00.01 | Microchip | ||
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LAN8700IC-AEZG-TR-CAG
Microchip Technology Inc
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Check for Price | Not Recommended | 12.5 MBps | 25 MHz | YES | 1.8 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | IT ALSO HAS IEEE802.3AB NETWORK PROTOCOL | NO | ASYNC, BIT; SYNC, BYTE | NRZI; BIPH-LEVEL(MANCHESTER) | YES | 4 | 41.3 mA | 3.6 V | 3 V | INDUSTRIAL | S-PQCC-N36 | e3 | 85 °C | -40 °C | TS 16949 | 36 | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 1 mm | 6 mm | 6 mm | MICROCHIP TECHNOLOGY INC | QFN-36 | compliant | EAR99 | 8542.39.00.01 | ||||
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LAN8700IC-AEZG-TR
SMSC
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Check for Price | Yes | Obsolete | 5 V | SERIAL IO/COMMUNICATION CONTROLLER, LAN | CMOS | NO | ASYNC, BIT | 1 | 5.5 V | 4.5 V | STANDARD MICROSYSTEMS CORP | unknown | 8542.31.00.01 |