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Parametric results for: ICS189 under Network Interfaces

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Manufacturer Part Number: ics189
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ICS1893CKLFT
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 3.3 V CMOS 1 100 Gbps INTERFACE CIRCUIT 1 160 µA COMMERCIAL S-PQCC-N56 e3 Not Qualified 3 70 °C 260 30 56 PLASTIC/EPOXY HVQCCN LCC56,.31SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 8 mm 8 mm 1 mm INTEGRATED DEVICE TECHNOLOGY INC DFN HVQCCN, LCC56,.31SQ,20 56 MLF compliant EAR99 8542.39.00.01
ICS1893CYI-10LF
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 3.3 V CMOS INTERFACE CIRCUIT 1 INDUSTRIAL S-PQFP-G64 e3 Not Qualified 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY HTFQFP SQUARE FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 10 mm 10 mm 1.2 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 10 X 10 MM, LEAD FREE, TQFP-64 64 unknown 8542.39.00.01
ICS1891
 Integrated Device Technology Inc 		Check for Price No Obsolete CMOS 1 100 Gbps ETHERNET TRANSCEIVER S-XQFP-G64 Not Qualified 64 QFP QFP64,.66SQ,32 SQUARE FLATPACK YES GULL WING 800 µm QUAD INTEGRATED CIRCUIT SYSTEMS INC QFP, QFP64,.66SQ,32 unknown 8542.39.00.01
ICS1892Y-10LF
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 5 V CMOS COMMERCIAL S-PQFP-G64 e3 Not Qualified 70 °C 64 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 10 mm 10 mm 1.6 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 10 X 10 MM, LQFP-64 64 compliant 8542.31.00.01 NO 25 MHz ASYNC, BIT NRZ; NRZI YES 1 5.25 V 4.75 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
ICS1893BFI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 3.3 V CMOS INTERFACE CIRCUIT 1 INDUSTRIAL R-PDSO-G48 e0 Not Qualified 85 °C -40 °C 48 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 635 µm DUAL 7.5 mm 15.875 mm 2.8 mm INTEGRATED DEVICE TECHNOLOGY INC SSOP 0.300 INCH, SSOP-48 48 not_compliant 8542.39.00.01
ICS1893AGLF
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 3.3 V CMOS 1 100 Gbps ETHERNET TRANSCEIVER 1 160 µA COMMERCIAL R-PDSO-G56 e3 Not Qualified 1 70 °C 260 30 56 PLASTIC/EPOXY TSSOP TSSOP56,.3,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) - annealed GULL WING 500 µm DUAL 6.1 mm 14 mm 1.2 mm INTEGRATED DEVICE TECHNOLOGY INC TSSOP 0.240 INCH, 0.50 MM PITCH, LEAD FREE, TSSOP-56 56 compliant 8542.39.00.01
ICS1893CKI-40LFT
 Integrated Device Technology Inc 		Check for Price Yes Obsolete 3.3 V CMOS 1 100 Gbps ETHERNET TRANSCEIVER 160 mA INDUSTRIAL S-PQCC-N40 e3 Not Qualified 3 85 °C -40 °C 260 30 40 PLASTIC/EPOXY QCCN LCC40,.24SQ,20 SQUARE CHIP CARRIER YES MATTE TIN NO LEAD 500 µm QUAD INTEGRATED DEVICE TECHNOLOGY INC unknown 8542.39.00.01
ICS1893BFLF
 Renesas Electronics Corporation 		Check for Price Yes End Of Life 3.3 V CMOS 1 100 Gbps INTERFACE CIRCUIT 1 160 µA COMMERCIAL R-PDSO-G48 e3 Not Qualified 1 70 °C 260 30 48 PLASTIC/EPOXY SSOP SSOP48,.4 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES Matte Tin (Sn) - annealed GULL WING 635 µm DUAL 7.5 mm 15.875 mm 2.8 mm RENESAS ELECTRONICS CORP 0.300 INCH, LEAD FREE, SSOP-48 compliant
ICS1893YI-10
 Integrated Circuit Systems Inc 		Check for Price No Transferred 3.3 V CMOS INTERFACE CIRCUIT 1 INDUSTRIAL S-PQFP-G64 e0 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY TFQFP SQUARE FLATPACK, THIN PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 10 mm 10 mm 1.2 mm INTEGRATED CIRCUIT SYSTEMS INC 10 X 10 MM, TQFP-64 unknown
ICS1890Y
 Integrated Device Technology Inc 		Check for Price No Obsolete 5 V CMOS S-PQFP-G64 e0 Not Qualified 64 PLASTIC/EPOXY QFP SQUARE FLATPACK YES TIN LEAD GULL WING 800 µm QUAD 14 mm 14 mm 3 mm INTEGRATED CIRCUIT SYSTEMS INC QFP QFP, 64 unknown 8542.31.00.01 NO ASYNC, BIT NRZ NO 1 5.25 V 4.75 V SERIAL IO/COMMUNICATION CONTROLLER, LAN 12.5 MBps 0
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