Findchips: Parametric Search Results for HCS139MS

Parametric results for: HCS139MS under Sockets and Chip Carriers

Select parts from the table below to compare.

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Select Parts		Part Number

		HCS139-344TT Advanced Interconnections Corp
		2-HCS139-01TG Advanced Interconnections Corp
		1HCS139-149GT Advanced Interconnections Corp
		HCS139DMSR Intersil Corporation
		1-HCS139-04GG Advanced Interconnections Corp
		5962R9580401V9A Harris Semiconductor
		1-HCS139-01TG Advanced Interconnections Corp
		1HCS139-153TT Advanced Interconnections Corp
		HCS139-04TT Advanced Interconnections Corp
		HCS139HMSR Intersil Corporation

			Most Relevant			Technical			Compliance	Operating Conditions		Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Number of Contacts	Contact Material	Terminal Pitch	Device Socket Type	Device Type Used On	Additional Feature	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Contact Configuration	Contact Finish Mating	Contact Finish Termination	Contact Style	Housing Material	Mating Contact Pitch	Mounting Style	PCB Contact Pattern	PCB Contact Row Spacing	Termination Type	Body Depth	Body Breadth	Body Length	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Package Description	Pin Count	Family	Input Conditioning	JESD-30 Code	Length	Load Capacitance (CL)	Logic IC Type	Max I(ol)	Number of Functions	Number of Terminals	Output Polarity	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Power Supply Current-Max (ICC)	Prop. Delay@Nom-Sup	Propagation Delay (tpd)	Qualification Status	Seated Height-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Surface Mount	Technology	Temperature Grade	Terminal Finish	Terminal Form	Terminal Position	Total Dose	Width

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

260 °C

-60 °C

14X14

SN-PB

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

1.3 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

260 °C

-60 °C

14X14

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

2.54 mm

125 °C

-55 °C

INTERSIL CORP

not_compliant

EAR99

8542.39.00.01

DIP

DIP, DIP16,.3

HC/UH

STANDARD

R-CDIP-T16

20.32 mm

50 pF

2-LINE TO 4-LINE DECODER

6 mA

INVERTED

CERAMIC, METAL-SEALED COFIRED

DIP

DIP16,.3

RECTANGULAR

IN-LINE

750 µA

27 ns

Not Qualified

5.08 mm

5.5 V

4.5 V

5 V

CMOS

MILITARY

TIN LEAD

THROUGH-HOLE

DUAL

200k Rad(Si) V

7.62 mm

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Transferred

125 °C

-55 °C

HARRIS SEMICONDUCTOR

unknown

EAR99

8542.39.00.01

DIE,

HC/UH

X-XUUC-N16

50 pF

INVERTED

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

27 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

MILITARY

TIN LEAD

NO LEAD

UPPER

100k Rad(Si) V

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

260 °C

-60 °C

14X14

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

Check for Price

Obsolete

INTERSIL CORP

unknown

EAR99

8542.39.00.01

DIP

DIE,

HC/UH

STANDARD

R-XUUC-N16

2.74 mm

50 pF

2-LINE TO 4-LINE DECODER

7.2 mA

INVERTED

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

40 µA

24 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

NO LEAD

UPPER

200k Rad(Si) V

2.69 mm

1 2 3 4 5 Next

Compare

HCS139-344TT

Advanced Interconnections Corp

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

260 °C

-60 °C

14X14

SN-PB

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

2-HCS139-01TG

Advanced Interconnections Corp

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

1.3 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1HCS139-149GT

Advanced Interconnections Corp

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

260 °C

-60 °C

14X14

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS139DMSR

Intersil Corporation

Check for Price

Obsolete

2.54 mm

125 °C

-55 °C

INTERSIL CORP

not_compliant

EAR99

8542.39.00.01

DIP

DIP, DIP16,.3

HC/UH

STANDARD

R-CDIP-T16

20.32 mm

50 pF

2-LINE TO 4-LINE DECODER

6 mA

INVERTED

CERAMIC, METAL-SEALED COFIRED

DIP

DIP16,.3

RECTANGULAR

IN-LINE

750 µA

27 ns

Not Qualified

5.08 mm

5.5 V

4.5 V

5 V

CMOS

MILITARY

TIN LEAD

THROUGH-HOLE

DUAL

200k Rad(Si) V

7.62 mm

1-HCS139-04GG

Advanced Interconnections Corp

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

AU ON NI

Gold (Au) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

5962R9580401V9A

Harris Semiconductor

Check for Price

Transferred

125 °C

-55 °C

HARRIS SEMICONDUCTOR

unknown

EAR99

8542.39.00.01

DIE,

HC/UH

X-XUUC-N16

50 pF

INVERTED

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

27 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

MILITARY

TIN LEAD

NO LEAD

UPPER

100k Rad(Si) V

1-HCS139-01TG

Advanced Interconnections Corp

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

AU ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.165 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

1HCS139-153TT

Advanced Interconnections Corp

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

260 °C

-60 °C

14X14

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.095 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS139-04TT

Advanced Interconnections Corp

Check for Price

Obsolete

139

BE-CU

2.54 mm

IC SOCKET

PGA139

2.5 OZ. AVG. INSERTION FORCE

260 °C

-60 °C

14X14

SN-PB ON NI

Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

RND PIN-SKT

GLASS FILLED THERMOPLASTIC

0.1 inch

STRAIGHT

RECTANGULAR

100 µm

SOLDER

0.12 inch

1.4 inch

ADVANCED INTERCONNECTIONS CORP

compliant

EAR99

8536.69.40.40

HCS139HMSR

Intersil Corporation

Check for Price

Obsolete

INTERSIL CORP

unknown

EAR99

8542.39.00.01

DIP

DIE,

HC/UH

STANDARD

R-XUUC-N16

2.74 mm

50 pF

2-LINE TO 4-LINE DECODER

7.2 mA

INVERTED

UNSPECIFIED

DIE

DIE OR CHIP

RECTANGULAR

UNCASED CHIP

40 µA

24 ns

Not Qualified

5.5 V

4.5 V

5 V

YES

CMOS

NO LEAD

UPPER

200k Rad(Si) V

2.69 mm

1 2 3 4 5 Next