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21 - 30 of 129 results
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HCS139-01TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 14X14 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||
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HCS139-04GT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | e4 | 150 °C | -60 °C | 14X14 | SN-PB ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED EPOXY | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||||||||||||
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HCS139-354TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | e0 | 260 °C | -60 °C | 14X14 | SN-PB | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||||||||||||
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HCS139-01GT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | e4 | 150 °C | -60 °C | 14X14 | SN-PB ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||||||||||||
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2-HCS139-29TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.4 inch | 1.3 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | ||||||||||||||||||||||||||||
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HCS139-04TG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 14X14 | AU ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.12 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||
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5962R9580401VXX
Renesas Electronics Corporation
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Check for Price | Obsolete | 1.27 mm | 125 °C | -55 °C | RENESAS ELECTRONICS CORP | compliant | EAR99 | 8542.39.00.01 | DFP, | HC/UH | STANDARD | R-CDFP-F16 | 2-LINE TO 4-LINE DECODER | 2 | 16 | INVERTED | CERAMIC, METAL-SEALED COFIRED | DFP | RECTANGULAR | FLATPACK | 27 ns | Not Qualified | 2.92 mm | 5.5 V | 4.5 V | 5 V | YES | CMOS | MILITARY | FLAT | DUAL | 100k Rad(Si) V | 6.73 mm | ||||||||||||||||||||||
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HCS139-49TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 14X14 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||
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1-HCS139-49GG
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | 2.5 OZ. AVG. INSERTION FORCE | e4 | 260 °C | -60 °C | 14X14 | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.095 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 | |||||||||||||||||||||||||||
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1-HCS139-29TT
Advanced Interconnections Corp
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Check for Price | No | Obsolete | 139 | BE-CU | 2.54 mm | IC SOCKET | PGA139 | 2.5 OZ. AVG. INSERTION FORCE | e0 | 260 °C | -60 °C | 14X14 | SN-PB ON NI | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.1 inch | STRAIGHT | RECTANGULAR | 100 µm | SOLDER | 0.165 inch | 1.4 inch | 1.4 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 |