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DAC1208D650HN/C1,5
Integrated Device Technology Inc
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$30.4966 | Yes | Yes | Obsolete | 12 | YES | D/A CONVERTER | OFFSET BINARY, 2'S COMPLEMENT BINARY | 2 | INDUSTRIAL | S-PQCC-N64 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | QCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | QCCN, LCC64,.35SQ,20 | compliant | 8542.39.00.01 | |||||||||||||||
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DAC1208D650HN
Integrated Device Technology Inc
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Check for Price | Obsolete | 1.8 V | 3.47 V | 1.8 V | 12 | YES | D/A CONVERTER | OFFSET BINARY, 2'S COMPLEMENT BINARY | SERIAL | 1 | 20 ns | INDUSTRIAL | S-PQCC-N64 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 9 mm | 1 mm | 9 mm | INTEGRATED DEVICE TECHNOLOGY INC | HVQCCN, | unknown | 8542.39.00.01 | ||||||||||||||
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DAC1208D650HN
NXP Semiconductors
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Check for Price | Transferred | 1.8 V | 3.47 V | 1.8 V | 12 | YES | D/A CONVERTER | OFFSET BINARY, 2'S COMPLEMENT BINARY | SERIAL | 1 | 20 ns | INDUSTRIAL | S-PQCC-N64 | Not Qualified | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 9 mm | 1 mm | 9 mm | NXP SEMICONDUCTORS | HVQCCN, | unknown | 8542.39.00.01 | QFN | 64 | |||||||||||
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DAC1208D650HN/C1,5
NXP Semiconductors
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Check for Price | Yes | Obsolete | 12 | YES | D/A CONVERTER | OFFSET BINARY, 2'S COMPLEMENT BINARY | 2 | INDUSTRIAL | S-PQCC-N64 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 64 | PLASTIC/EPOXY | QCCN | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | unknown | ||||||||||||||||||
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DAC1208D650HN-C1
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 1.8 V | 3.47 V | 1.8 V | 12 | YES | D/A CONVERTER | OFFSET BINARY, 2'S COMPLEMENT BINARY | SERIAL | 1 | 20 ns | INDUSTRIAL | S-PQCC-N64 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 1 mm | 9 mm | INTEGRATED DEVICE TECHNOLOGY INC | 9 X 9 MM, 0.85 MM HEIGHT, PLASTIC, SOT804-3, HVQFN-64 | compliant | 8542.39.00.01 | VFQFPN | 64 | NLG64 | ||||
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DAC1208D650HN-C18
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 1.8 V | 3.47 V | 1.8 V | 12 | YES | D/A CONVERTER | OFFSET BINARY, 2'S COMPLEMENT BINARY | SERIAL | 1 | 20 ns | INDUSTRIAL | S-PQCC-N64 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 9 mm | 1 mm | 9 mm | INTEGRATED DEVICE TECHNOLOGY INC | 9 X 9 MM, 0.85 MM HEIGHT, PLASTIC, SOT804-3, HVQFN-64 | compliant | 8542.39.00.01 | VFQFPN | 64 | NLG64 |