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Parametric results for: BALF-NRG-02D3 under Cellular Telephone Circuits

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Manufacturer Part Number: balfnrg02d3

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	Part Number

BALF-NRG-02D3

STMicroelectronics

			Technical		Compliance		Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Telecom IC Type	Number of Functions	JESD-30 Code	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	Samacsys Manufacturer

$0.0954

Yes

Active

RF AND BASEBAND CIRCUIT

R-PBGA-B4

105 °C

-40 °C

260

PLASTIC/EPOXY

VBGA

BGA4,2X2,40/16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

855 µm

1.385 mm

690 µm

STMICROELECTRONICS

CSPG-4

compliant

STMicroelectronics

Compare

BALF-NRG-02D3

STMicroelectronics

$0.0954

Yes

Active

RF AND BASEBAND CIRCUIT

R-PBGA-B4

105 °C

-40 °C

260

PLASTIC/EPOXY

VBGA

BGA4,2X2,40/16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

855 µm

1.385 mm

690 µm

STMICROELECTRONICS

CSPG-4

compliant

STMicroelectronics