Parametric results for: 74HC2G17 under Gates

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Manufacturer Part Number: 74hc2g17
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74HC2G17GW,125
Nexperia
$0.0857 Yes Active 5 V 175 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR, 7 INCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP SMT-6 6 SOT363-2 compliant 8542.39.00.01 2017-02-01 Nexperia
74HC2G17GV,125
Nexperia
$0.1738 Yes Active 5 V 175 ns 2 1 YES TSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE TR, 7 INCH TIN GULL WING 950 µm DUAL 1.1 mm 1.5 mm 2.9 mm NEXPERIA TSOP TSOP-6 6 SOT457 compliant 8542.39.00.01 2017-02-01 Nexperia EAR99
74HC2G17GW-G
Nexperia
Check for Price Active 5 V 175 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NEXPERIA TSSOP, compliant 8542.39.00.01 2017-02-01
74HC2G17GV
NXP Semiconductors
Check for Price Yes Yes Transferred 5 V 175 ns 34 ns 2 1 YES TSSOP 50 pF YES HC/UH BUFFER CMOS 4 mA 6 V 2 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY TSOP6,.11,37 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TR Tin (Sn) GULL WING 950 µm DUAL 1.1 mm 1.5 mm 2.9 mm NXP SEMICONDUCTORS TSOP PLASTIC, SOT-457, SC-74, TSOP-6 6 compliant 8542.39.00.01
74HC2G17GW-G
NXP Semiconductors
Check for Price Yes Transferred 5 V 175 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 Not Qualified e3 1 125 °C -40 °C NOT SPECIFIED NOT SPECIFIED 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS SOT-363 GREEN, PLASTIC, SOT-363, SC-88, SMT-6 6 unknown 8542.39.00.01
935281033125
NXP Semiconductors
Check for Price Transferred 5 V 175 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 125 °C -40 °C 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH TIN GULL WING 950 µm DUAL 1.1 mm 1.5 mm 2.9 mm NXP SEMICONDUCTORS TSSOP, unknown 8542.39.00.01
935302017125
NXP Semiconductors
Check for Price Transferred 5 V 175 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 125 °C -40 °C AEC-Q100 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 950 µm DUAL 1.1 mm 1.5 mm 2.9 mm NXP SEMICONDUCTORS TSSOP, unknown 8542.39.00.01
74HC2G17GV-Q100
NXP Semiconductors
Check for Price Transferred 5 V 175 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 125 °C -40 °C AEC-Q100 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 950 µm DUAL 1.1 mm 1.5 mm 2.9 mm NXP SEMICONDUCTORS TSOP TSSOP, 6 unknown 8542.39.00.01
935281033125
Nexperia
Check for Price Yes Active 5 V 175 ns 2 1 YES TSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 e3 1 125 °C -40 °C 260 30 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE TR, 7 INCH TIN GULL WING 950 µm DUAL 1.1 mm 1.5 mm 2.9 mm NEXPERIA TSOP, compliant 8542.39.00.01 2017-02-01
74HC2G17GW-Q100
NXP Semiconductors
Check for Price Transferred 5 V 175 ns 2 1 YES TSSOP HC/UH BUFFER CMOS 6 V 2 V AUTOMOTIVE R-PDSO-G6 125 °C -40 °C AEC-Q100 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GULL WING 650 µm DUAL 1.1 mm 1.25 mm 2 mm NXP SEMICONDUCTORS SOT-363 TSSOP, 6 unknown 8542.39.00.01