Findchips: Parametric Search Results for 74HC2G17

Parametric results for: 74HC2G17 under Gates

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		74HC2G17GW,125 Nexperia
		74HC2G17GV,125 Nexperia
		74HC2G17GW-G Nexperia
		74HC2G17GV NXP Semiconductors
		74HC2G17GW-G NXP Semiconductors
		935281033125 NXP Semiconductors
		935302017125 NXP Semiconductors
		74HC2G17GV-Q100 NXP Semiconductors
		935281033125 Nexperia
		74HC2G17GW-Q100 NXP Semiconductors

				Most Relevant										Technical						Compliance			Operating Conditions						Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Propagation Delay (tpd)	Prop. Delay@Nom-Sup	Number of Functions	Number of Inputs	Surface Mount	Package Code	Load Capacitance (CL)	Schmitt Trigger	Family	Logic IC Type	Technology	Max I(ol)	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Equivalence Code	Package Shape	Package Style	Packing Method	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	HTS Code	Date Of Intro	Samacsys Manufacturer	ECCN Code

$0.0857

Yes

Active

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP

SMT-6

SOT363-2

compliant

8542.39.00.01

2017-02-01

Nexperia

$0.1738

Yes

Active

5 V

175 ns

YES

TSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

TR, 7 INCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSOP

TSOP-6

SOT457

compliant

8542.39.00.01

2017-02-01

Nexperia

EAR99

Check for Price

Active

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP,

compliant

8542.39.00.01

2017-02-01

Check for Price

Yes

Transferred

5 V

175 ns

34 ns

YES

TSSOP

50 pF

YES

HC/UH

BUFFER

CMOS

4 mA

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

PLASTIC, SOT-457, SC-74, TSOP-6

compliant

8542.39.00.01

Check for Price

Yes

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

SOT-363

GREEN, PLASTIC, SOT-363, SC-88, SMT-6

unknown

8542.39.00.01

Check for Price

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSSOP,

unknown

8542.39.00.01

Check for Price

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSSOP,

unknown

8542.39.00.01

Check for Price

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

TSSOP,

unknown

8542.39.00.01

Check for Price

Yes

Active

5 V

175 ns

YES

TSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

TR, 7 INCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSOP,

compliant

8542.39.00.01

2017-02-01

Check for Price

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

SOT-363

TSSOP,

unknown

8542.39.00.01

1 2 3 Next

Compare

74HC2G17GW,125

Nexperia

$0.0857

Yes

Active

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TR, 7 INCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP

SMT-6

SOT363-2

compliant

8542.39.00.01

2017-02-01

Nexperia

74HC2G17GV,125

Nexperia

$0.1738

Yes

Active

5 V

175 ns

YES

TSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

TR, 7 INCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSOP

TSOP-6

SOT457

compliant

8542.39.00.01

2017-02-01

Nexperia

EAR99

74HC2G17GW-G

Nexperia

Check for Price

Active

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NEXPERIA

TSSOP,

compliant

8542.39.00.01

2017-02-01

74HC2G17GV

NXP Semiconductors

Check for Price

Yes

Transferred

5 V

175 ns

34 ns

YES

TSSOP

50 pF

YES

HC/UH

BUFFER

CMOS

4 mA

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

TSOP6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

PLASTIC, SOT-457, SC-74, TSOP-6

compliant

8542.39.00.01

74HC2G17GW-G

NXP Semiconductors

Check for Price

Yes

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

Not Qualified

125 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

SOT-363

GREEN, PLASTIC, SOT-363, SC-88, SMT-6

unknown

8542.39.00.01

935281033125

NXP Semiconductors

Check for Price

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSSOP,

unknown

8542.39.00.01

935302017125

NXP Semiconductors

Check for Price

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSSOP,

unknown

8542.39.00.01

74HC2G17GV-Q100

NXP Semiconductors

Check for Price

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NXP SEMICONDUCTORS

TSOP

TSSOP,

unknown

8542.39.00.01

935281033125

Nexperia

Check for Price

Yes

Active

5 V

175 ns

YES

TSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

260

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

TR, 7 INCH

TIN

GULL WING

950 µm

DUAL

1.1 mm

1.5 mm

2.9 mm

NEXPERIA

TSOP,

compliant

8542.39.00.01

2017-02-01

74HC2G17GW-Q100

NXP Semiconductors

Check for Price

Transferred

5 V

175 ns

YES

TSSOP

HC/UH

BUFFER

CMOS

6 V

2 V

AUTOMOTIVE

R-PDSO-G6

125 °C

-40 °C

AEC-Q100

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

GULL WING

650 µm

DUAL

1.1 mm

1.25 mm

2 mm

NXP SEMICONDUCTORS

SOT-363

TSSOP,

unknown

8542.39.00.01

1 2 3 Next