Findchips: Parametric Search Results for 5962-8765001LA


Select Parts		Part Number

		5962-8765001LA Cypress Semiconductor
		5962-8765001LA e2v technologies
		5962-8765001LA STMicroelectronics
		5962-8765001LA QP Semiconductor
		5962-8765001LA Waferscale Integration Inc

				Most Relevant					Technical															Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

16.384 kbit

2KX8

5 V

50 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

13.5 V

120 mA

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

WDIP

DIP24,.3

RECTANGULAR

IN-LINE, WINDOW

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

31.877 mm

7.62 mm

CYPRESS SEMICONDUCTOR CORP

DIP

0.300 INCH, WINDOWED, CERDIP-24

not_compliant

3A001.A.2.C

8542.32.00.61

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Active

16.384 kbit

2KX8

5 V

50 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

13.5 V

120 mA

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

TELEDYNE E2V (UK) LTD

DIP

DIP, DIP24,.3

compliant

3A001.A.2.C

8542.32.00.61

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Obsolete

16.384 kbit

2KX8

5 V

50 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

13.5 V

120 mA

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

STMICROELECTRONICS

DIP

0.300 INCH, WINDOWED, CERDIP-24

not_compliant

3A001.A.2.C

8542.32.00.61

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Transferred

16.384 kbit

2KX8

5 V

50 ns

UVPROM

2000

2.048 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

DUAL

QP SEMICONDUCTOR INC

DIP

DIP,

unknown

3A001.A.2.C

8542.32.00.61

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Obsolete

16.384 kbit

2KX8

5 V

50 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

13.5 V

120 mA

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

WAFERSCALE INTEGRATION INC

CERAMIC, DIP-24

unknown

3A001.A.2.C

8542.32.00.61

Compare

5962-8765001LA

Cypress Semiconductor

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

50 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

13.5 V

120 mA

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

WDIP

DIP24,.3

RECTANGULAR

IN-LINE, WINDOW

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

31.877 mm

7.62 mm

CYPRESS SEMICONDUCTOR CORP

DIP

0.300 INCH, WINDOWED, CERDIP-24

not_compliant

3A001.A.2.C

8542.32.00.61

5962-8765001LA

e2v technologies

Check for Price

Active

16.384 kbit

2KX8

5 V

50 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

13.5 V

120 mA

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

TELEDYNE E2V (UK) LTD

DIP

DIP, DIP24,.3

compliant

3A001.A.2.C

8542.32.00.61

5962-8765001LA

STMicroelectronics

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

50 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

13.5 V

120 mA

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

STMICROELECTRONICS

DIP

0.300 INCH, WINDOWED, CERDIP-24

not_compliant

3A001.A.2.C

8542.32.00.61

5962-8765001LA

QP Semiconductor

Check for Price

Transferred

16.384 kbit

2KX8

5 V

50 ns

UVPROM

2000

2.048 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

DUAL

QP SEMICONDUCTOR INC

DIP

DIP,

unknown

3A001.A.2.C

8542.32.00.61

5962-8765001LA

Waferscale Integration Inc

Check for Price

Obsolete

16.384 kbit

2KX8

5 V

50 ns

UVPROM

COMMON

2000

2.048 k

ASYNCHRONOUS

3-STATE

PARALLEL

13.5 V

120 mA

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

WAFERSCALE INTEGRATION INC

CERAMIC, DIP-24

unknown

3A001.A.2.C

8542.32.00.61

Parametric results for: 5962-8765001LA under EPROMs