Findchips: Parametric Search Results for 27c64

Parametric results for: 27c64 under OTP ROMs

Select parts from the table below to compare.

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Select Parts		Part Number

		27C64-25/P Microchip Technology Inc
		AM27C64-125JC AMD
		AM27C64-55PC AMD
		SPM27C64C15 Seiko Epson Corporation
		M27C64A-15K1TR STMicroelectronics
		27C64-12E/K Microchip Technology Inc
		27C64T-20/SO Microchip Technology Inc
		N27C64-2 Intel Corporation
		27C64MQ30 Thales Group
		27C64Q200/883 National Semiconductor Corporation

				Most Relevant					Technical															Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

20 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

4.83 mm

36.32 mm

15.24 mm

MICROCHIP TECHNOLOGY INC

DIP

0.600 INCH, PLASTIC, DIP-28

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

120 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

QCCJ

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

J BEND

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

QCCJ, LCC32,.45X.55

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

55 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

25 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

150 ns

COMMON

8000

8.192 k

3-STATE

21 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

SEIKO EPSON CORP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

65.536 kbit

8KX8

5 V

150 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

LEAD FREE, PLASTIC, LCC-32

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

120 ns

EPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

20 µA

5.5 V

4.5 V

CMOS

AUTOMOTIVE

R-CQCC-N32

Not Qualified

125 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

MICROCHIP TECHNOLOGY INC

QFJ

CERAMIC, LCC-32

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

28 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

2.65 mm

17.9 mm

7.5 mm

MICROCHIP TECHNOLOGY INC

SOIC

0.300 INCH, PLASTIC, SOIC-28

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

30 µA

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

J BEND

1.27 mm

QUAD

INTEL CORP

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

65.536 kbit

8KX8

5 V

300 ns

UVPROM

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

THOMSON-CSF SEMICONDUCTORS

DIP

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

20 µA

CMOS

MILITARY

R-XDIP-T28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

DIP, DIP28,.6

compliant

3A001.A.2.C

8542.32.00.61

1 2 3 4 5 Next

Compare

27C64-25/P

Microchip Technology Inc

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

250 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

20 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

4.83 mm

36.32 mm

15.24 mm

MICROCHIP TECHNOLOGY INC

DIP

0.600 INCH, PLASTIC, DIP-28

unknown

EAR99

8542.32.00.71

AM27C64-125JC

AMD

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

120 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

NOT SPECIFIED

PLASTIC/EPOXY

QCCJ

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

J BEND

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

QCCJ, LCC32,.45X.55

unknown

EAR99

8542.32.00.71

AM27C64-55PC

AMD

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

55 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

25 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

SPM27C64C15

Seiko Epson Corporation

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

150 ns

COMMON

8000

8.192 k

3-STATE

21 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

SEIKO EPSON CORP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

M27C64A-15K1TR

STMicroelectronics

Check for Price

Yes

Obsolete

65.536 kbit

8KX8

5 V

150 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

3.56 mm

13.97 mm

11.43 mm

STMICROELECTRONICS

QFJ

LEAD FREE, PLASTIC, LCC-32

compliant

EAR99

8542.32.00.71

27C64-12E/K

Microchip Technology Inc

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

120 ns

EPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

20 µA

5.5 V

4.5 V

CMOS

AUTOMOTIVE

R-CQCC-N32

Not Qualified

125 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

MICROCHIP TECHNOLOGY INC

QFJ

CERAMIC, LCC-32

unknown

EAR99

8542.32.00.61

27C64T-20/SO

Microchip Technology Inc

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

28 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

2.65 mm

17.9 mm

7.5 mm

MICROCHIP TECHNOLOGY INC

SOIC

0.300 INCH, PLASTIC, SOIC-28

unknown

EAR99

8542.32.00.71

N27C64-2

Intel Corporation

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

OTP ROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

30 µA

CMOS

COMMERCIAL

R-PQCC-J32

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

YES

Tin/Lead (Sn/Pb)

J BEND

1.27 mm

QUAD

INTEL CORP

unknown

EAR99

8542.32.00.71

27C64MQ30

Thales Group

Check for Price

Transferred

65.536 kbit

8KX8

5 V

300 ns

UVPROM

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

THOMSON-CSF SEMICONDUCTORS

DIP

unknown

3A001.A.2.C

8542.32.00.61

27C64Q200/883

National Semiconductor Corporation

Check for Price

Obsolete

65.536 kbit

8KX8

5 V

200 ns

UVPROM

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

13 V

100 µA

20 µA

CMOS

MILITARY

R-XDIP-T28

Not Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

NATIONAL SEMICONDUCTOR CORP

DIP, DIP28,.6

compliant

3A001.A.2.C

8542.32.00.61

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