Findchips: Parametric Search Results for 1N4370A

Parametric results for: 1N4370A under Zener Diodes

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		1N4370A Microsemi Corporation
		1N4370A-1 Microchip Technology Inc
		JAN1N4370A-1 Microchip Technology Inc
		JAN1N4370A-1 Microsemi Corporation
		JANTX1N4370A-1 Microchip Technology Inc
		1N4370AUR-1 Microsemi Corporation
		1N4370AUR-1 Microchip Technology Inc
		JANTXV1N4370A-1 Microchip Technology Inc
		JAN1N4370AUR-1 Microchip Technology Inc
		JANHCA1N4370A Microchip Technology Inc

				Most Relevant											Technical					Compliance					Operating Conditions			Physical								Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Working Test Current	Reverse Current-Max	Power Dissipation-Max	Reference Voltage-Nom	Diode Element Material	Diode Type	Polarity	Configuration	Surface Mount	Number of Elements	Technology	Additional Feature	Dynamic Impedance-Max	Reverse Test Voltage	Voltage Temp Coeff-Max	Voltage Tol-Max	Qualification Status	JESD-30 Code	JESD-609 Code	Reference Standard	JEDEC-95 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Case Connection	Number of Terminals	Package Body Material	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$2.4711

Transferred

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

30 Ω

5 %

Not Qualified

O-LALF-W2

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROSEMI CORP

DO-7

HERMETIC SEALED, GLASS PACKAGE-2

compliant

EAR99

8541.10.00.50

Microsemi Corporation

$2.5703

Active

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LALF-W2

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

$3.0059

Active

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LALF-W2

MIL-19500/127

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

$3.8082

Transferred

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LALF-W2

MIL-19500/127

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROSEMI CORP

DO-35

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

Microsemi Corporation

$4.4521

Active

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LALF-W2

MIL-19500/127

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

$6.1189

Transferred

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LELF-R2

DO-213AA

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

DO-213AA

HERMETIC SEALED, GLASS, MELF-2

unknown

EAR99

8541.10.00.50

Microsemi Corporation

$6.1882

Active

20 mA

100 µA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

30 Ω

1 V

-2.04 mV/°C

5 %

Not Qualified

O-LELF-R2

DO-213AA

175 °C

-65 °C

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

Microchip

$6.3832

Active

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LALF-W2

MIL-19500/127

DO-35

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

$7.4723

Active

20 mA

100 µA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

30 Ω

1 V

-2.04 mV/°C

5 %

Qualified

O-LELF-R2

MIL-19500

DO-213AA

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

$8.0387

Active

31 mA

1 W

8.2 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

2 %

Qualified

MIL-19500/115K

CATHODE

UNCASED CHIP

Tin/Lead (Sn/Pb)

UNSPECIFIED

MICROCHIP TECHNOLOGY INC

compliant

1 2 3 4 5 Next

Compare

1N4370A

Microsemi Corporation

$2.4711

Transferred

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

30 Ω

5 %

Not Qualified

O-LALF-W2

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROSEMI CORP

DO-7

HERMETIC SEALED, GLASS PACKAGE-2

compliant

EAR99

8541.10.00.50

Microsemi Corporation

1N4370A-1

Microchip Technology Inc

$2.5703

Active

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LALF-W2

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

JAN1N4370A-1

Microchip Technology Inc

$3.0059

Active

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LALF-W2

MIL-19500/127

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

JAN1N4370A-1

Microsemi Corporation

$3.8082

Transferred

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LALF-W2

MIL-19500/127

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROSEMI CORP

DO-35

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

Microsemi Corporation

JANTX1N4370A-1

Microchip Technology Inc

$4.4521

Active

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LALF-W2

MIL-19500/127

DO-35

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

1N4370AUR-1

Microsemi Corporation

$6.1189

Transferred

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LELF-R2

DO-213AA

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

DO-213AA

HERMETIC SEALED, GLASS, MELF-2

unknown

EAR99

8541.10.00.50

Microsemi Corporation

1N4370AUR-1

Microchip Technology Inc

$6.1882

Active

20 mA

100 µA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

30 Ω

1 V

-2.04 mV/°C

5 %

Not Qualified

O-LELF-R2

DO-213AA

175 °C

-65 °C

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

Microchip

JANTXV1N4370A-1

Microchip Technology Inc

$6.3832

Active

20 mA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LALF-W2

MIL-19500/127

DO-35

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WIRE

AXIAL

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

JAN1N4370AUR-1

Microchip Technology Inc

$7.4723

Active

20 mA

100 µA

500 mW

2.4 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

30 Ω

1 V

-2.04 mV/°C

5 %

Qualified

O-LELF-R2

MIL-19500

DO-213AA

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

JANHCA1N4370A

Microchip Technology Inc

$8.0387

Active

31 mA

1 W

8.2 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

2 %

Qualified

MIL-19500/115K

CATHODE

UNCASED CHIP

Tin/Lead (Sn/Pb)

UNSPECIFIED

MICROCHIP TECHNOLOGY INC

compliant

1 2 3 4 5 Next