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SE7271T-R
Skyworks Solutions Inc
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$0.0901 | Obsolete | 3.3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | 85 °C | -40 °C | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 3 mm | 3 mm | 600 µm | SKYWORKS SOLUTIONS INC | QFN | HVQCCN, | 20 | unknown | 8542.39.00.01 | ||||||||||||||||||||||
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AP22802AW5-7
Diodes Incorporated
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$0.1385 | Yes | Not Recommended | 5 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-G5 | 1 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25, 5 PIN | compliant | 8542.39.00.01 | EAR99 | Diodes Incorporated | NO | 5.5 V | 2.7 V | |||||||||||||
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BGS12SN6E6327XTSA1
Infineon Technologies AG
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$0.1515 | Yes | Obsolete | 2.6 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B6 | e3 | 1 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | Tin (Sn) | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | 1.10 X 0.70 MM, 0.31 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TSNP-6 | compliant | Infineon | ||||||||||||||||||
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AP22802BW5-7
Diodes Incorporated
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$0.1557 | Yes | Not Recommended | 5 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-G5 | 85 °C | -40 °C | 260 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25, 5 PIN | compliant | 8542.39.00.01 | EAR99 | Diodes Incorporated | NO | 5.5 V | 2.7 V | |||||||||||||||
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AP22814BSN-7
Diodes Incorporated
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$0.1631 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N6 | e4 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 650 µm | DUAL | 2 mm | 2 mm | 630 µm | DIODES INC | UDFN-6 | compliant | 8542.39.00.01 | EAR99 | Diodes Incorporated | |||||||||||||||||
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SL3S1204FTB0/1X
NXP Semiconductors
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$0.1764 | Yes | Obsolete | TELECOM CIRCUIT | e3 | 1 | 260 | 30 | Tin (Sn) | NXP SEMICONDUCTORS | SON | 6 | compliant | NXP | SOT886 | ||||||||||||||||||||||||||||||||||
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AP22811AM8-13
Diodes Incorporated
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$0.1802 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G8 | e3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 2.95 mm | 3 mm | 1.1 mm | DIODES INC | MSOP-8 | compliant | 8542.39.00.01 | EAR99 | Diodes Incorporated | |||||||||||||||||
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SL3S1203FTB0,115
NXP Semiconductors
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$0.1899 | Yes | Obsolete | 1.8 V | CMOS | TELECOM CIRCUIT | 1 | 265 µA | INDUSTRIAL | R-PDSO-N6 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VSON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 500 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | SON | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 | 6 | compliant | NXP | SOT886 | |||||||||||
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SL3S1202FTB1,115
NXP Semiconductors
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$0.1991 | Yes | Obsolete | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PBCC-B3 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 3 | PLASTIC/EPOXY | BCC | LCC3(UNSPEC) | RECTANGULAR | CHIP CARRIER | YES | Tin (Sn) | BUTT | 550 µm | BOTTOM | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | SON | 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1122, SON-3 | 3 | compliant | NXP | SOT1122 | |||||||||||||
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AP22814ASN-7
Diodes Incorporated
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$0.1992 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N6 | e4 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 650 µm | DUAL | 2 mm | 2 mm | 630 µm | DIODES INC | UDFN-6 | compliant | 8542.39.00.01 | EAR99 | Diodes Incorporated |