Part Details for SL3S1202FTB1,115 by NXP Semiconductors
Overview of SL3S1202FTB1,115 by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for SL3S1202FTB1,115
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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Rochester Electronics | SL3S1202F - U-CODE G2XM and G2XL RoHS: Compliant Status: Obsolete Min Qty: 1 | 4965 |
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$0.1503 / $0.1768 | Buy Now |
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DISTI #
2890414RL
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element14 Asia-Pacific | RFID, READ, WRITE, 960MHZ, XSON-3 RoHS: Compliant Min Qty: 100 Container: Reel | 0 |
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$0.1693 / $0.2896 | Buy Now |
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DISTI #
2890414
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element14 Asia-Pacific | RFID, READ, WRITE, 960MHZ, XSON-3 RoHS: Compliant Min Qty: 5 Container: Cut Tape | 0 |
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$0.1693 / $0.3995 | Buy Now |
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DISTI #
2890414
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Farnell | RFID, READ, WRITE, 960MHZ, XSON-3 RoHS: Compliant Min Qty: 5000 Lead time: 30 Weeks, 0 Days Container: Cut Tape | 0 |
|
$0.1860 | Buy Now |
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DISTI #
2890414RL
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Farnell | RFID, READ, WRITE, 960MHZ, XSON-3 RoHS: Compliant Min Qty: 5000 Lead time: 30 Weeks, 0 Days Container: Reel | 0 |
|
$0.1860 | Buy Now |
Part Details for SL3S1202FTB1,115
SL3S1202FTB1,115 CAD Models
SL3S1202FTB1,115 Part Data Attributes
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SL3S1202FTB1,115
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
SL3S1202FTB1,115
NXP Semiconductors
SL3ICS1002/1202 - UCODE G2XM and G2XL SON 3-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SON | |
| Package Description | 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1122, SON-3 | |
| Pin Count | 3 | |
| Manufacturer Package Code | SOT1122 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | R-PBCC-B3 | |
| JESD-609 Code | e3 | |
| Length | 1.45 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BCC | |
| Package Equivalence Code | LCC3(UNSPEC) | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.5 mm | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | BUTT | |
| Terminal Pitch | 0.55 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 1 mm |