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41 - 50 of 45,137 results
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UPD77533S1-YHC
Renesas Electronics Corporation
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Check for Price | Obsolete | 1.5 V | MOS | TELECOM CIRCUIT | 1 | OTHER | S-PBGA-B108 | Not Qualified | 85 °C | -20 °C | 108 | PLASTIC/EPOXY | LFBGA | BGA108,12X12,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 11 mm | 11 mm | 1.66 mm | RENESAS ELECTRONICS CORP | BGA | LFBGA, BGA108,12X12,32 | 108 | unknown | 8542.39.00.01 | |||||||||||
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PT1482B-01
Western Digital Corp
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Check for Price | No | Obsolete | MOS | COMMERCIAL | R-PDIP-T40 | e0 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WESTERN DIGITAL CORP | DIP, DIP40,.6 | unknown | 8542.39.00.01 | |||||||||||||||||
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MX346LH
Mx Com Inc
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Check for Price | No | Obsolete | 5 V | MOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-J24 | e0 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | QCCJ | LDCC24,.44SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | 10.05 mm | 10.05 mm | 3.7 mm | MX COM INC | QCCJ, LDCC24,.44SQ | unknown | 8542.39.00.01 | ||||||||||
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EFB7332P
STMicroelectronics
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Check for Price | Obsolete | 5 V | MOS | CEPT PCM-30/E-1 | T-1(DS1) | 30 mA | COMMERCIAL | R-PDIP-T16 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | STMICROELECTRONICS | compliant | 8542.39.00.01 | |||||||||||||||||
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BGS15M2A12E6327XTSA1
Infineon Technologies AG
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Check for Price | Yes | Yes | Obsolete | MOS | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B12 | 1 | 85 °C | -30 °C | 12 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.9 mm | 650 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | |||||||||||||
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MC6172PS
Freescale Semiconductor
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Check for Price | No | Obsolete | MOS | COMMERCIAL | R-PDIP-T24 | e0 | Not Qualified | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP24,.6 | unknown | 8542.39.00.01 | |||||||||||||||||
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M5912F1
SGS-Ates Componenti Electronici SPA
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Check for Price | No | Obsolete | 5 V | MOS | T-1(DS1) | -5 V | COMMERCIAL | R-XDIP-T16 | e0 | Not Qualified | 70 °C | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SGS-ATES COMPONENTI ELECTRONICI S P A | DIP, DIP16,.3 | unknown | 8542.39.00.01 | ||||||||||||||
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EF7331P
Thomson Components-Mostek Corp
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Check for Price | No | Obsolete | 5 V | MOS | COMMERCIAL | R-PDIP-T28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | THOMSON COMPONENTS-MOSTEK CORP | DIP, DIP28,.6 | unknown | 8542.39.00.01 | ||||||||||||||||
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UPD9993F9-BA3
NEC Electronics America Inc
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Check for Price | Obsolete | 3 V | MOS | TELECOM CIRCUIT | 1 | OTHER | S-PBGA-B85 | Not Qualified | 85 °C | -20 °C | 85 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY | YES | BALL | 500 µm | BOTTOM | 6 mm | 6 mm | 930 µm | NEC ELECTRONICS AMERICA INC | 6 X 6 MM, 0.50 MM PITCH, FBGA-85 | unknown | |||||||||||||||
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MJ1474/DG
Dynex Semiconductor
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Check for Price | No | Obsolete | MOS | COMMERCIAL | R-XDIP-T24 | e0 | Not Qualified | 70 °C | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GEC PLESSEY SEMICONDUCTORS | DIP, DIP24,.6 | unknown | 8542.39.00.01 |