Parametric results for: bgm11s22f256ga-v2 under Other Telecom ICs

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BGSA12UGL8E6327XTSA1
Infineon Technologies AG
$0.3135 Yes Active TELECOM CIRCUIT 1 INFINEON TECHNOLOGIES AG , compliant 8542.39.00.01 Infineon
AP2280-2FMG-7
Diodes Incorporated
$0.3234 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-N6 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.07,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.8125 mm 2.0125 mm 605 µm DIODES INC DFN-6 compliant 8542.39.00.01 Diodes Incorporated DFN 6 EAR99 NO 6 V 1.5 V
HT2MOA4S20/E/3/RJ
NXP Semiconductors
$0.3234 Yes Active HYBRID TELECOM CIRCUIT e4 Not Qualified PLASTIC/EPOXY MODULE(UNSPEC) MICROELECTRONIC ASSEMBLY Silver (Ag) NXP SEMICONDUCTORS compliant NXP COB 35 SOT500-2
AP22814BM8-13
Diodes Incorporated
$0.3299 Yes Active TELECOM CIRCUIT e3 260 30 MATTE TIN DIODES INC , compliant 8542.39.00.01 Diodes Incorporated EAR99
RF37S114HTFJB
Texas Instruments
$0.3347 No Active TELECOM CIRCUIT SEATED HT-CALCULATED 1 OTHER S-XXMA-X 1 70 °C -25 °C 260 30 UNSPECIFIED XMA SQUARE MICROELECTRONIC ASSEMBLY YES UNSPECIFIED UNSPECIFIED 4 mm 4 mm 760 µm TEXAS INSTRUMENTS INC , compliant 8542.31.00.01 Texas Instruments EAR99
AP2281-3FMG-7
Diodes Incorporated
$0.3514 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-N6 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.07,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.81 mm 2 mm 605 µm DIODES INC HVSON, compliant 8542.39.00.01 Diodes Incorporated DFN 6 EAR99 NO 6 V 1.5 V
ATA5577M1330C-DDB
Microchip Technology Inc
$0.3745 Yes Active 3.6 V TELECOM CIRCUIT 1 INDUSTRIAL R-XUUC-N2 Not Qualified 85 °C -40 °C 2 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP NO NO LEAD UPPER MICROCHIP TECHNOLOGY INC compliant 8523.59.00.00 Microchip 5A991.G
AP2281-1FMG-7
Diodes Incorporated
$0.3838 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-N6 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.07,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.81 mm 2 mm 605 µm DIODES INC DFN-6 compliant 8542.39.00.01 Diodes Incorporated DFN 6 EAR99 NO 6 V 1.5 V
BGA123L4E6327XTSA1
Infineon Technologies AG
$0.3985 Yes Active 1.8 V TELECOM CIRCUIT 1 INDUSTRIAL S-XBCC-N4 1 85 °C -40 °C 4 UNSPECIFIED VQCCN SQUARE CHIP CARRIER, VERY THIN PROFILE YES NO LEAD 400 µm BOTTOM 700 µm 700 µm 320 µm INFINEON TECHNOLOGIES AG VQCCN, compliant 8542.39.00.01 Infineon
AP2281-1WG-7
Diodes Incorporated
$0.3991 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-G6 3 85 °C -40 °C 260 30 6 PLASTIC/EPOXY LSSOP TSOP6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.45 mm DIODES INC LSSOP, compliant 8542.39.00.01 Diodes Incorporated SOT 6 EAR99 NO 6 V 1.5 V