Parametric results for: SKY%20CONTROL under Cellular Telephone Circuits

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BALF-NRG-02D3
STMicroelectronics
$0.0734 Yes Active RF AND BASEBAND CIRCUIT 1 R-PBGA-B4 e1 105 °C -40 °C 260 30 4 PLASTIC/EPOXY VBGA BGA4,2X2,40/16 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 855 µm 1.385 mm 690 µm STMICROELECTRONICS CSPG-4 compliant STMicroelectronics
BGU7258X
NXP Semiconductors
$0.3474 Yes Not Recommended 3.3 V RF AND BASEBAND CIRCUIT 1 S-PDSO-N6 e4 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.06,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 1.6 mm 1.6 mm 500 µm NXP SEMICONDUCTORS XSON-6 compliant NXP DFN 6 SOT1189-1 8542.33.00.01
BGS8L2X
NXP Semiconductors
$0.3475 Yes Not Recommended RF FRONT END CIRCUIT 1 260 NXP SEMICONDUCTORS compliant NXP SON 6 SOT1232 8542.33.00.01
BGC100GN6E6327XTSA1
Infineon Technologies AG
$0.3935 Yes Active CMOS RF AND BASEBAND CIRCUIT 1 R-XBCC-B6 1 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES BUTT BOTTOM INFINEON TECHNOLOGIES AG BCC, compliant Infineon 8542.39.00.01
BGA7L1BN6E6327XTSA1
Infineon Technologies AG
$0.4718 Yes Active 2.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-N6 e3 1 85 °C -40 °C 6 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES Tin (Sn) NO LEAD 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG VQCCN, compliant Infineon 8542.39.00.01
MAX2608EUT+T
Maxim Integrated Products
$0.4936 Yes Yes Transferred 2.75 V BASEBAND CIRCUIT 1 INDUSTRIAL R-PDSO-G6 e3 Not Qualified 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.625 mm 2.9 mm 1.45 mm MAXIM INTEGRATED PRODUCTS INC LSSOP, compliant SOT-23 6 8542.39.00.01 EAR99
BGA7H1BN6E6327XTSA1
Infineon Technologies AG
$0.4984 Yes Active 2.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-N6 e3 1 85 °C -40 °C 6 PLASTIC/EPOXY VQCCN RECTANGULAR CHIP CARRIER, VERY THIN PROFILE YES Tin (Sn) NO LEAD 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG VQCCN, compliant Infineon 8542.39.00.01
LMV225TLX/NOPB
Texas Instruments
$0.5564 Yes Yes Active 2.7 V 1 RF AND BASEBAND CIRCUIT 1 8 mA INDUSTRIAL S-PBGA-B4 e1 Not Qualified 1 85 °C -40 °C 260 30 4 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 1.014 mm 1.014 mm 675 µm TEXAS INSTRUMENTS INC SMD-4 compliant Texas Instruments DSBGA 4 8542.39.00.01 EAR99
LMV225URX/NOPB
Texas Instruments
$0.5564 Yes Yes Active 5 V 1 RF AND BASEBAND CIRCUIT 1 8 mA S-XBGA-B4 e1 1 260 30 4 UNSPECIFIED VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL BOTTOM TEXAS INSTRUMENTS INC compliant Texas Instruments 8542.39.00.01 EAR99
LTE3401HX
NXP Semiconductors
$0.5732 Yes End Of Life 1.8 V RF AND BASEBAND CIRCUIT 1 INDUSTRIAL R-PBCC-B6 1 85 °C -40 °C 260 6 PLASTIC/EPOXY BCC RECTANGULAR CHIP CARRIER YES BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm NXP SEMICONDUCTORS BCC, compliant NXP 8542.33.00.01 2018-10-26