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1 - 10 of 4,787 results
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BALF-NRG-02D3
STMicroelectronics
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$0.0734 | Yes | Active | RF AND BASEBAND CIRCUIT | 1 | R-PBGA-B4 | e1 | 105 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VBGA | BGA4,2X2,40/16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 855 µm | 1.385 mm | 690 µm | STMICROELECTRONICS | CSPG-4 | compliant | STMicroelectronics | ||||||||||||||||
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BGU7258X
NXP Semiconductors
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$0.3474 | Yes | Not Recommended | 3.3 V | RF AND BASEBAND CIRCUIT | 1 | S-PDSO-N6 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.06,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 1.6 mm | 1.6 mm | 500 µm | NXP SEMICONDUCTORS | XSON-6 | compliant | NXP | DFN | 6 | SOT1189-1 | 8542.33.00.01 | ||||||||||
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BGS8L2X
NXP Semiconductors
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$0.3475 | Yes | Not Recommended | RF FRONT END CIRCUIT | 1 | 260 | NXP SEMICONDUCTORS | compliant | NXP | SON | 6 | SOT1232 | 8542.33.00.01 | ||||||||||||||||||||||||||||||||
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BGC100GN6E6327XTSA1
Infineon Technologies AG
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$0.3935 | Yes | Active | CMOS | RF AND BASEBAND CIRCUIT | 1 | R-XBCC-B6 | 1 | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | BOTTOM | INFINEON TECHNOLOGIES AG | BCC, | compliant | Infineon | 8542.39.00.01 | ||||||||||||||||||||||||
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BGA7L1BN6E6327XTSA1
Infineon Technologies AG
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$0.4718 | Yes | Active | 2.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-N6 | e3 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | VQCCN, | compliant | Infineon | 8542.39.00.01 | |||||||||||||||
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MAX2608EUT+T
Maxim Integrated Products
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$0.4936 | Yes | Yes | Transferred | 2.75 V | BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G6 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.625 mm | 2.9 mm | 1.45 mm | MAXIM INTEGRATED PRODUCTS INC | LSSOP, | compliant | SOT-23 | 6 | 8542.39.00.01 | EAR99 | |||||||||
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BGA7H1BN6E6327XTSA1
Infineon Technologies AG
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$0.4984 | Yes | Active | 2.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-N6 | e3 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | VQCCN, | compliant | Infineon | 8542.39.00.01 | |||||||||||||||
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LMV225TLX/NOPB
Texas Instruments
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$0.5564 | Yes | Yes | Active | 2.7 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | S-PBGA-B4 | e1 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.014 mm | 1.014 mm | 675 µm | TEXAS INSTRUMENTS INC | SMD-4 | compliant | Texas Instruments | DSBGA | 4 | 8542.39.00.01 | EAR99 | ||||||
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LMV225URX/NOPB
Texas Instruments
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$0.5564 | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | S-XBGA-B4 | e1 | 1 | 260 | 30 | 4 | UNSPECIFIED | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | BOTTOM | TEXAS INSTRUMENTS INC | compliant | Texas Instruments | 8542.39.00.01 | EAR99 | |||||||||||||||||
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LTE3401HX
NXP Semiconductors
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$0.5732 | Yes | End Of Life | 1.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-B6 | 1 | 85 °C | -40 °C | 260 | 6 | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | NXP SEMICONDUCTORS | BCC, | compliant | NXP | 8542.33.00.01 | 2018-10-26 |