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Parametric results for: tle5203s under Other uPs/uCs/Peripheral ICs

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AR1100-I/MQ
 Microchip Technology Inc 		$0.7035 Yes Not Recommended YES 3.3 V MICROPROCESSOR CIRCUIT CMOS ALSO OPERATES AT 5V SUPPLY 3.465 V 3.135 V INDUSTRIAL S-PQCC-N20 e3 85 °C -40 °C TS 16949 20 PLASTIC/EPOXY HVQCCN LCC20,.20SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 650 µm QUAD 1 mm 5 mm 5 mm MICROCHIP TECHNOLOGY INC QFN 5 X 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, QFN-20 20 compliant EAR99 8542.39.00.01 Microchip
TEA1791T/N1,118
 NXP Semiconductors 		$0.7277 Yes Active YES 20 V R-PDSO-G8 Not Qualified 1 260 NOT SPECIFIED 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE GULL WING 1.27 mm DUAL NXP SEMICONDUCTORS SOIC 8 compliant NXP SOT96-1
MTCH6102T-I/MV
 Microchip Technology Inc 		$0.7476 Yes Not Recommended YES 3 V MICROPROCESSOR CIRCUIT CMOS 3.6 V 1.8 V INDUSTRIAL S-PQCC-N28 e3 1 85 °C -40 °C 260 TS 16949 40 28 PLASTIC/EPOXY HVQCCN LCC28,.16SQ,16 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 400 µm QUAD 550 µm 4 mm 4 mm MICROCHIP TECHNOLOGY INC 5.30 MM, PLASTIC, SSOP-28 compliant EAR99 8542.31.00.01 Microchip
NT3H2211W0FT1X
 NXP Semiconductors 		$0.7505 Yes Active YES 1.8 V NFC CONTROLLER CMOS 3.6 V 1.67 V R-PDSO-G8 e4 1 105 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) GULL WING 1.27 mm DUAL 1.75 mm 3.9 mm 4.9 mm NXP SEMICONDUCTORS SOIC 8 compliant 8542.32.00 NXP SOT96-1
TEA1792T/N1,118
 NXP Semiconductors 		$0.7530 Yes Active YES 20 V R-PDSO-G8 Not Qualified 1 260 NOT SPECIFIED 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE GULL WING 1.27 mm DUAL NXP SEMICONDUCTORS SOIC 8 compliant NXP SOT96-1
PN7120A0EV/C10801Y
 NXP Semiconductors 		$0.7839 Yes Obsolete YES 1.8 V OTHER S-PBGA-B49 Not Qualified e1 3 85 °C -30 °C 260 30 49 PLASTIC/EPOXY FBGA BGA49,7X7,20 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 500 µm BOTTOM NXP SEMICONDUCTORS BGA 49 compliant NXP SOT1320-1
ATECC608B-MAHDA-T
 Microchip Technology Inc 		$0.8025 Yes Active YES CRYPTOGRAPHIC AUTHENTICATOR CMOS I2C 5.5 V 2 V INDUSTRIAL R-PDSO-N8 e4 1 85 °C -40 °C 260 8 PLASTIC/EPOXY HVSON SOLCC8,.12,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 600 µm 2 mm 3 mm MICROCHIP TECHNOLOGY INC UDFN-8 compliant Microchip
ATECC608B-MAHCZ-T
 Microchip Technology Inc 		$0.8025 Yes Active YES CRYPTOGRAPHIC AUTHENTICATOR CMOS 1-WIRE 5.5 V 2 V INDUSTRIAL R-PDSO-N8 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.12,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 500 µm DUAL 600 µm 2 mm 3 mm MICROCHIP TECHNOLOGY INC UDFN-8 compliant Microchip
NT3H2111W0FTTJ
 NXP Semiconductors 		$0.8096 Yes Active YES 1.8 V NFC CONTROLLER CMOS 3.6 V 1.67 V S-PDSO-G8 e4 1 105 °C -40 °C 260 30 8 PLASTIC/EPOXY TSSOP TSSOP8,.2 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 650 µm DUAL 1.1 mm 3 mm 3 mm NXP SEMICONDUCTORS TSSOP 8 compliant 8542.32.00 NXP SOT505-1
ATECC608B-MAHCZ-S
 Microchip Technology Inc 		$0.8265 Yes Active YES CRYPTOGRAPHIC AUTHENTICATOR CMOS 1-WIRE 5.5 V 2 V INDUSTRIAL R-PDSO-N8 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.12,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE NO LEAD 500 µm DUAL 600 µm 2 mm 3 mm MICROCHIP TECHNOLOGY INC UDFN-8 compliant Microchip
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